Invention Grant
- Patent Title: IC with connections between linking module and test access ports
- Patent Title (中): IC连接在连接模块和测试访问端口之间
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Application No.: US14460824Application Date: 2014-08-15
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Publication No.: US08977918B2Publication Date: 2015-03-10
- Inventor: Baher S. Haroun , Lee D. Whetsel
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; Frederick J. Telecky, Jr.
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/3177 ; G01R31/3185 ; G11C29/46

Abstract:
An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation.
Public/Granted literature
- US20140359387A1 TAP AND LINKING MODULE FOR SCAN ACCESS OF MULTIPLE CORES WITH IEEE 1149.1 TEST ACCESS PORTS Public/Granted day:2014-12-04
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