Invention Grant
- Patent Title: Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
- Patent Title (中): 电路板及其制造方法以及具有该电路板的电光装置
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Application No.: US13776737Application Date: 2013-02-26
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Publication No.: US08979372B2Publication Date: 2015-03-17
- Inventor: Pei-Chang Huang , Wen-Fang Liu , Cheng-Po Yu
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Priority: TW101140584A 20121101
- Main IPC: G02B6/12
- IPC: G02B6/12 ; H05K3/46

Abstract:
A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer is disposed on the substrate and the waveguide layer. The second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer. The convex structure is disposed on the sidewall of the waveguide layer. The convex structure and the waveguide layer respectively have refractive index n1 and n2, and |n1−n2|/n1
Public/Granted literature
- US20140119688A1 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRO-OPTIC APPARATUS HAVING THE CIRCUIT BOARD Public/Granted day:2014-05-01
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