公开(公告)号：US20160097130A1

公开(公告)日：2016-04-07

申请号：US14504436

申请日：2014-10-02

申请人： Unimicron Technology Corp.

发明人： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC分类号： C23C18/28 ,  C23C18/32 ,  C23C18/42 ,  C23C18/16

CPC分类号： C23C18/1689 ,  C23C18/1644 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/42

摘要： A preparation method of a conductive sponge includes the following steps. First, a sponge substrate is dipped in a metal solution and then taken out. A first drying process is performed. Next, the sponge substrate plated with metal particles is dipped in a carbon nanomaterial suspension and then taken out. Then, a second drying process is performed.

摘要翻译： 导电海绵的制备方法包括以下步骤。 首先将海绵基材浸入金属溶液中，然后取出。 进行第一次干燥处理。 接下来，将镀有金属颗粒的海绵基材浸渍在碳纳米材料悬浮液中，然后取出。 然后进行第二干燥处理。

公开(公告)号：US09095083B2

公开(公告)日：2015-07-28

申请号：US14074655

申请日：2013-11-07

申请人： Unimicron Technology Corp.

发明人： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC分类号： B05D5/12 ,  H05K3/46 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  B05D7/00 ,  H05K3/12 ,  H05K1/02 ,  H05K3/24 ,  H05K1/11 ,  C23C18/16

CPC分类号： H05K1/0298 ,  B05D5/12 ,  B05D7/50 ,  C23C18/165 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/0038 ,  H05K3/12 ,  H05K3/244 ,  H05K3/40 ,  H05K3/46 ,  H05K3/4679 ,  H05K2203/1476

摘要： A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.

摘要翻译： 多层电路板的制造方法包括以下步骤。 首先，提供具有穿过基板的第一通孔的基板。 接下来，通过使用第一通孔作为取向对象，在基板的表面上形成图案化电路层。 第一图案化电路层包括围绕第一通孔的第一同心圆图案。 接下来，在表面上形成第一层叠层。 然后，形成从同心圆图案的中心的第一同心圆正交地突出在第一堆叠层和基板上的第一通孔贯穿区域。 接着，在第一堆叠层上形成第二层叠层。 之后，形成从同心圆图案的中心的第二同心圆正交地突出在第一，第二堆叠层和基板上的第二通孔贯穿区域。

公开(公告)号：US20150125625A1

公开(公告)日：2015-05-07

申请号：US14074655

申请日：2013-11-07

申请人： Unimicron Technology Corp.

发明人： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC分类号： H05K3/46 ,  H05K3/10 ,  H05K3/00

CPC分类号： H05K1/0298 ,  B05D5/12 ,  B05D7/50 ,  C23C18/165 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/0038 ,  H05K3/12 ,  H05K3/244 ,  H05K3/40 ,  H05K3/46 ,  H05K3/4679 ,  H05K2203/1476

摘要： A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.

摘要翻译： 多层电路板的制造方法包括以下步骤。 首先，提供具有穿过基板的第一通孔的基板。 接下来，通过使用第一通孔作为取向对象，在基板的表面上形成图案化电路层。 第一图案化电路层包括围绕第一通孔的第一同心圆图案。 接下来，在表面上形成第一层叠层。 然后，形成从同心圆图案的中心的第一同心圆正交地突出在第一堆叠层和基板上的第一通孔贯穿区域。 接着，在第一堆叠层上形成第二层叠层。 之后，形成从同心圆图案的中心的第二同心圆正交地突出在第一，第二堆叠层和基板上的第二通孔贯穿区域。

公开(公告)号：US20150121693A1

公开(公告)日：2015-05-07

申请号：US14073869

申请日：2013-11-07

申请人： Unimicron Technology Corp.

发明人： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang ,  Ai-Hwa Lim

IPC分类号： H05K3/40 ,  H05K3/46

CPC分类号： H05K3/4038 ,  B05D5/12 ,  B05D7/50 ,  C23C18/1655 ,  H05K1/0269 ,  H05K1/0298 ,  H05K1/111 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/12 ,  H05K3/244 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2203/107 ,  H05K2203/1536 ,  Y10T29/49165

摘要： A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

摘要翻译： 多层电路板的制造方法包括以下步骤。 首先，将两个芯层压缩以形成具有彼此相对的两个表面的基板。 然后，形成连接表面的通孔。 然后通过使用通孔作为对准靶，在每个表面上形成包括同心圆图案的图案化电路层。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 然后在每个第一堆叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US11445596B2

公开(公告)日：2022-09-13

申请号：US17153856

申请日：2021-01-20

申请人： Unimicron Technology Corp.

发明人： Chin-Sheng Wang ,  Pei-Chang Huang

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K3/00

摘要： A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion.

公开(公告)号：US10515870B1

公开(公告)日：2019-12-24

申请号：US16029659

申请日：2018-07-09

申请人： Unimicron Technology Corp.

发明人： Chin-Sheng Wang ,  Pei-Chang Huang ,  Ra-Min Tain

IPC分类号： H01L23/367 ,  H01L23/467 ,  H01L23/498

摘要： A package carrier includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask. The multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The gas-permeable structure is in the form of a mesh and disposed in at least one of the through holes. The first and the second outer circuit layers respectively at least cover the upper and the lower surfaces. At least one first opening of the first solder mask exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure. At least one second opening of the second solder mask exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-permeable structure.

公开(公告)号：US20190371704A1

公开(公告)日：2019-12-05

申请号：US16029659

申请日：2018-07-09

申请人： Unimicron Technology Corp.

发明人： Chin-Sheng Wang ,  Pei-Chang Huang ,  Ra-Min Tain

IPC分类号： H01L23/467 ,  H01L23/498 ,  H01L23/367

摘要： A package carrier includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask. The multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The gas-permeable structure is in the form of a mesh and disposed in at least one of the through holes. The first and the second outer circuit layers respectively at least cover the upper and the lower surfaces. At least one first opening of the first solder mask exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure. At least one second opening of the second solder mask exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-peiuieable structure.

公开(公告)号：US09581774B2

公开(公告)日：2017-02-28

申请号：US15164878

申请日：2016-05-26

申请人： Unimicron Technology Corp.

发明人： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC分类号： G02B6/43 ,  G02B6/42 ,  H01L31/0232 ,  G02B6/12 ,  G02B6/32

CPC分类号： G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

摘要： An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

摘要翻译： 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。

公开(公告)号：US20140119688A1

公开(公告)日：2014-05-01

申请号：US13776737

申请日：2013-02-26

申请人： UNIMICRON TECHNOLOGY CORP.

发明人： Pei-Chang Huang ,  Wen-Fang Liu ,  Cheng-Po Yu

IPC分类号： G02B6/12 ,  H05K3/46

CPC分类号： G02B6/12 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4232 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/4626 ,  H05K2201/0187 ,  H05K2201/10121 ,  Y10T29/49126

摘要： A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer is disposed on the substrate and the waveguide layer. The second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer. The convex structure is disposed on the sidewall of the waveguide layer. The convex structure and the waveguide layer respectively have refractive index n1 and n2, and |n1-n21|n1

摘要翻译： 提供一种电路板及其制造方法以及具有该电路板的电光装置。 电路板包括：基板，包括第一介电层和设置在其上的第一电路层;布置在基板的一部分上的波导层，第二介电层，凸结构和第二电路层。 第二介电层设置在基板和波导层上。 第二电介质层具有暴露波导层的侧壁和第一电路层的一部分的开口。 凸形结构设置在波导层的侧壁上。 凸形结构和波导层分别具有折射率n1和n2，| n1-n21 | n1 <1％。 凸结构的表面粗糙度小于波导层的侧壁的表面粗糙度。 第二电路层设置在第二电介质层上。

公开(公告)号：US09377596B2

公开(公告)日：2016-06-28

申请号：US14337248

申请日：2014-07-22

申请人： Unimicron Technology Corp.

发明人： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC分类号： G02B6/43 ,  G02B6/42 ,  H01L31/0232

CPC分类号： G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

摘要： An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

摘要翻译： 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。