公开(公告)号：US08979372B2

公开(公告)日：2015-03-17

申请号：US13776737

申请日：2013-02-26

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Wen-Fang Liu ,  Cheng-Po Yu

IPC: G02B6/12 ,  H05K3/46

CPC classification number: G02B6/12 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4232 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/4626 ,  H05K2201/0187 ,  H05K2201/10121 ,  Y10T29/49126

Abstract: A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer is disposed on the substrate and the waveguide layer. The second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer. The convex structure is disposed on the sidewall of the waveguide layer. The convex structure and the waveguide layer respectively have refractive index n1 and n2, and |n1−n2|/n1

Abstract translation: 提供一种电路板及其制造方法以及具有该电路板的电光装置。 电路板包括：基板，包括第一介电层和设置在其上的第一电路层;布置在基板的一部分上的波导层，第二介电层，凸结构和第二电路层。 第二介电层设置在基板和波导层上。 第二电介质层具有暴露波导层的侧壁和第一电路层的一部分的开口。 凸形结构设置在波导层的侧壁上。 凸结构和波导层分别具有折射率n1和n2，| n1-n2 | / n1 <1％。 凸结构的表面粗糙度小于波导层的侧壁的表面粗糙度。 第二电路层设置在第二电介质层上。

公开(公告)号：US20140119688A1

公开(公告)日：2014-05-01

申请号：US13776737

申请日：2013-02-26

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Pei-Chang Huang ,  Wen-Fang Liu ,  Cheng-Po Yu

IPC: G02B6/12 ,  H05K3/46

CPC classification number: G02B6/12 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4232 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/4626 ,  H05K2201/0187 ,  H05K2201/10121 ,  Y10T29/49126

Abstract: A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer is disposed on the substrate and the waveguide layer. The second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer. The convex structure is disposed on the sidewall of the waveguide layer. The convex structure and the waveguide layer respectively have refractive index n1 and n2, and |n1-n21|n1

Abstract translation: 提供一种电路板及其制造方法以及具有该电路板的电光装置。 电路板包括：基板，包括第一介电层和设置在其上的第一电路层;布置在基板的一部分上的波导层，第二介电层，凸结构和第二电路层。 第二介电层设置在基板和波导层上。 第二电介质层具有暴露波导层的侧壁和第一电路层的一部分的开口。 凸形结构设置在波导层的侧壁上。 凸形结构和波导层分别具有折射率n1和n2，| n1-n21 | n1 <1％。 凸结构的表面粗糙度小于波导层的侧壁的表面粗糙度。 第二电路层设置在第二电介质层上。

公开(公告)号：US20180295723A1

公开(公告)日：2018-10-11

申请号：US16008060

申请日：2018-06-14

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Wen-Fang Liu

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/111 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/3452 ,  H05K3/4697 ,  H05K2201/0376 ,  H05K2203/0228 ,  H05K2203/025

Abstract: A manufacturing method of a circuit board structure includes the following steps: providing an inner circuit structure which includes a core layer; performing a build-up process to laminate a first build-up circuit structure on a first patterned circuit layer of the inner circuit structure, wherein the first build-up circuit structure includes an inner dielectric layer, and the inner dielectric layer directly covers an upper surface of the core layer and the first patterned circuit layer; removing a portion of the first build-up circuit structure to form an opening extending from a first surface of the first build-up circuit structure relatively far away from the inner circuit structure to a portion of the inner dielectric layer; performing a sandblasting process on a first inner surface of the inner dielectric layer exposed by the opening to at least remove the portion of the inner dielectric layer exposed by the opening.

公开(公告)号：US10039184B2

公开(公告)日：2018-07-31

申请号：US15427061

申请日：2017-02-08

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Wen-Fang Liu

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/111 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/3452 ,  H05K3/4697 ,  H05K2201/0376 ,  H05K2203/0228 ,  H05K2203/025

Abstract: A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface opposite to each other, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive via connecting the first and the second patterned circuit layers. The first build-up circuit structure is disposed on the upper surface of the core layer and covers the first patterned circuit layer, wherein the first build-up circuit structure at least has a cavity, the cavity exposes a portion of the first patterned circuit layer and a cross-sectional profile of an edge of a top surface of the portion of the first patterned circuit layer exposed by the cavity is a curved surface.

公开(公告)号：US10356901B2

公开(公告)日：2019-07-16

申请号：US16008060

申请日：2018-06-14

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Wen-Fang Liu

IPC: H05K1/11 ,  H05K3/00 ,  H01L21/32 ,  H01L23/48 ,  H05K3/46 ,  H05K3/34

Abstract: A manufacturing method of a circuit board structure includes the following steps: providing an inner circuit structure which includes a core layer; performing a build-up process to laminate a first build-up circuit structure on a first patterned circuit layer of the inner circuit structure, wherein the first build-up circuit structure includes an inner dielectric layer, and the inner dielectric layer directly covers an upper surface of the core layer and the first patterned circuit layer; removing a portion of the first build-up circuit structure to form an opening extending from a first surface of the first build-up circuit structure relatively far away from the inner circuit structure to a portion of the inner dielectric layer; performing a sandblasting process on a first inner surface of the inner dielectric layer exposed by the opening to at least remove the portion of the inner dielectric layer exposed by the opening.

公开(公告)号：US10813231B2

公开(公告)日：2020-10-20

申请号：US16592748

申请日：2019-10-03

Applicant: Unimicron Technology Corp.

Inventor： Po-Hsuan Liao ,  Wen-Fang Liu

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/10 ,  H01L21/02 ,  H01L21/48 ,  H01L21/56 ,  H01L21/67 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H05K3/38 ,  H05K1/03 ,  H05K3/46

Abstract: The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer.

公开(公告)号：US10477701B2

公开(公告)日：2019-11-12

申请号：US15836937

申请日：2017-12-11

Applicant: Unimicron Technology Corp.

Inventor： Po-Hsuan Liao ,  Wen-Fang Liu

IPC: H05K1/11 ,  H05K1/18 ,  H01L21/02 ,  H01L21/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/70 ,  H01L21/768 ,  H01L21/4763 ,  H01L23/00 ,  H01L23/48 ,  H01L23/52 ,  H05K3/38 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10

Abstract: A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has at least one through hole. The through hole has an inner wall. The second dielectric layer is disposed on the adhesive layer and has a second through hole communicated with the first through hole. The conductive line is located in the second through hole of the second dielectric layer and is in contact with the inner wall of the adhesive layer.

公开(公告)号：US20190067543A1

公开(公告)日：2019-02-28

申请号：US15826702

申请日：2017-11-30

Applicant: Unimicron Technology Corp.

Inventor： Wen-Fang Liu ,  Shao-Chien Lee ,  Chen-Wei Tseng ,  Zong-Hua Li

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/62

Abstract: A heat dissipation substrate structure includes a multilayer circuit board including a core board and build-up boards, a heat conduction layer, a cavity structure, bonding pads, and vias. The heat conduction layer is disposed within the core board, or on a surface of the core board, or on a surface of one of the build-up boards. The cavity structure is in the multilayer circuit board with respect to the heat conduction layer and exposes a first surface of the heat conduction layer. The bonding pads are on the surface of the multilayer circuit board at a side of a second surface of the heat conduction layer. The portions of the vias are connected to portions of the bonding pads and the heat conduction layer. Accordingly, heat flow can be distributed via a heat dissipation path from the bonding pads through the vias to the heat conduction layer.

公开(公告)号：US20180368263A1

公开(公告)日：2018-12-20

申请号：US15622078

申请日：2017-06-14

Applicant: Unimicron Technology Corp.

Inventor： Wen-Fang Liu ,  Shao-Chien Lee ,  Chen-Wei Tseng ,  Zong-Hua Li ,  Chien-Tsai Li

IPC: H05K1/18 ,  H05K1/11

Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.

公开(公告)号：US10159151B1

公开(公告)日：2018-12-18

申请号：US15622078

申请日：2017-06-14

Applicant: Unimicron Technology Corp.

Inventor： Wen-Fang Liu ,  Shao-Chien Lee ,  Chen-Wei Tseng ,  Zong-Hua Li ,  Chien-Tsai Li

IPC: H05K1/18 ,  H05K1/11

Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.