Invention Grant
US08980750B2 Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate salt
有权
包含非离子表面活性剂和碳酸盐的化学机械抛光（CMP）组合物
- Patent Title: Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate salt
- Patent Title (中): 包含非离子表面活性剂和碳酸盐的化学机械抛光（CMP）组合物
-
Application No.: US13933427Application Date: 2013-07-02
-
Publication No.: US08980750B2Publication Date: 2015-03-17
- Inventor: Robert Reichardt , Yuzhuo Li , Michael Lauter , Wei Lan William Chiu
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L21/302
- IPC: H01L21/302 ; C09G1/02 ; H01L21/306 ; H01L21/321
Abstract:
A chemical mechanical polishing (CMP) composition (Q) comprising (A) Inorganic particles, organic particles, or a mixture or composite thereof, wherein the particles are cocoon-shaped (B) a non-ionic surfactant, (C) a carbonate or hydrogen carbonate salt, (D) an alcohol, and (M) an aqueous medium.
Public/Granted literature
- US20140011361A1 CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING A NON-IONIC SURFACTANT AND A CARBONATE SALT Public/Granted day:2014-01-09
Information query
IPC分类:
