Invention Grant
- Patent Title: Semiconductor structure and integrated circuit
- Patent Title (中): 半导体结构和集成电路
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Application No.: US14072976Application Date: 2013-11-06
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Publication No.: US08981488B1Publication Date: 2015-03-17
- Inventor: Yung-Ju Wen , Tien-Hao Tang , Chang-Tzu Wang
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L27/092

Abstract:
A semiconductor structure and an integrated circuit are provided. The semiconductor structure includes a first field-effect transistor (FET), a second FET, an isolation structure, and a body electrode. The first FET includes a first active body having a first type conductivity. The second FET includes a second active body having the first type conductivity. The first active body and the second active body are isolated from each other by the isolation structure. The body electrode has the first type conductivity and formed in the second active body.
Information query
IPC分类: