发明授权
- 专利标题: Wiring layout having differently shaped vias
- 专利标题(中): 接线布局具有不同形状的通孔
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申请号: US12134381申请日: 2008-06-06
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公开(公告)号: US08981562B2公开(公告)日: 2015-03-17
- 发明人: Harry Chuang , Kong-Beng Thei , Chih-Tsung Yao , Heng-Kai Liu , Ming-Jer Chiu , Chien-Wen Chen
- 申请人: Harry Chuang , Kong-Beng Thei , Chih-Tsung Yao , Heng-Kai Liu , Ming-Jer Chiu , Chien-Wen Chen
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; G03F1/00 ; G03F1/36 ; H01L21/768 ; H01L21/311
摘要:
A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.
公开/授权文献
- US20080237885A1 Method for Improving Design Window 公开/授权日:2008-10-02
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