Invention Grant
US08982362B2 System and method for measuring layer thickness and depositing semiconductor layers
有权
用于测量层厚度和沉积半导体层的系统和方法
- Patent Title: System and method for measuring layer thickness and depositing semiconductor layers
- Patent Title (中): 用于测量层厚度和沉积半导体层的系统和方法
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Application No.: US13645000Application Date: 2012-10-04
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Publication No.: US08982362B2Publication Date: 2015-03-17
- Inventor: Erel Milshtein
- Applicant: First Solar, Inc.
- Applicant Address: US OH Perrysburg
- Assignee: First Solar, Inc.
- Current Assignee: First Solar, Inc.
- Current Assignee Address: US OH Perrysburg
- Agency: Dickstein Shapiro LLP
- Main IPC: G01B11/28
- IPC: G01B11/28 ; G01N21/86 ; G01V8/00 ; G01B11/06 ; H01L21/02 ; H01L21/66 ; C23C16/455 ; C23C16/52 ; H01L31/073 ; H01L31/0749 ; H01L31/18
Abstract:
Described herein is a method and apparatus for measuring the thickness of a deposited semiconductor material. A colorimeter has an optical source that illuminates a portion of a deposited semiconductor material with optical radiation, a sensor that collects and measures color information related to reflected radiation from the deposited semiconductor material, and a processor that receives the color information related to the reflected radiation from the sensor and calculates a thickness of the semiconductor material. The processor may control a semiconductor material deposition apparatus.
Public/Granted literature
- US20130095577A1 SYSTEM AND METHOD FOR MEASURING LAYER THICKNESS AND DEPOSITING SEMICONDUCTOR LAYERS Public/Granted day:2013-04-18
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