发明授权
US08993376B2 Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die
有权
用基极引线和嵌入式半导体芯片形成晶圆级多行蚀刻引线框的半导体器件和方法
- 专利标题： Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die
- 专利标题（中）： 用基极引线和嵌入式半导体芯片形成晶圆级多行蚀刻引线框的半导体器件和方法
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申请号： US13284811申请日： 2011-10-28
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公开(公告)号： US08993376B2公开(公告)日： 2015-03-31
- 发明人: Zigmund R. Camacho , Emmanuel A. Espiritu , Henry D. Bathan , Dioscoro A. Merilo
- 申请人： Zigmund R. Camacho , Emmanuel A. Espiritu , Henry D. Bathan , Dioscoro A. Merilo
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC, Ltd.
- 当前专利权人： STATS ChipPAC, Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Patent Law Group: Atkins and Associates, P.C.
- 代理商 Robert D. Atkins
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/00 ; H01L25/065 ; H01L25/10 ; H01L25/00 ; H01L23/495 ; H01L21/48 ; H01L25/16
摘要：
A semiconductor device has a base substrate with first and second opposing surfaces. A plurality of cavities and base leads between the cavities is formed in the first surface of the base substrate. The first set of base leads can have a different height or similar height as the second set of base leads. A concave capture pad can be formed over the second set of base leads. Alternatively, a plurality of openings can be formed in the base substrate and the semiconductor die mounted to the openings. A semiconductor die is mounted between a first set of the base leads and over a second set of the base leads. An encapsulant is deposited over the die and base substrate. A portion of the second surface of the base substrate is removed to separate the base leads. An interconnect structure is formed over the encapsulant and base leads.
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