Invention Grant
- Patent Title: Semiconductor devices including a nanowire and methods of manufacturing the same
- Patent Title (中): 包括纳米线的半导体器件及其制造方法
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Application No.: US13193690Application Date: 2011-07-29
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Publication No.: US08993991B2Publication Date: 2015-03-31
- Inventor: Dongwoo Suh , Sung Bock Kim , Hojun Ryu
- Applicant: Dongwoo Suh , Sung Bock Kim , Hojun Ryu
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2010-0127787 20101214
- Main IPC: H01L29/06
- IPC: H01L29/06 ; B82Y10/00 ; B82Y40/00 ; H01L29/66 ; H01L29/775 ; H01L29/786 ; H01L21/02

Abstract:
Provided are semiconductor devices and methods of manufacturing the same. The semiconductor device includes a substrate including a first top surface, a second top surface lower in level than the first top surface, and a first perpendicular surface disposed between the first and second top surfaces, a first source/drain region formed under the first top surface, a first nanowire extended from the first perpendicular surface in one direction and being spaced apart from the second top surface, a second nanowire extended from a side surface of the first nanowire in the one direction, being spaced apart from the second top surface, and including a second source/drain region, a gate electrode on the first nanowire, and a dielectric layer between the first nanowire and the gate electrode.
Public/Granted literature
- US20120145999A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2012-06-14
Information query
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