Invention Grant
- Patent Title: Substrate bonding system and mobile chamber used thereto
- Patent Title (中): 基板接合系统和移动室
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Application No.: US13577458Application Date: 2010-11-26
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Publication No.: US08999099B2Publication Date: 2015-04-07
- Inventor: Yong-Won Cha , Sang Wook Yoo , Gun-Woo Park , Seung-Hee Jung
- Applicant: Yong-Won Cha , Sang Wook Yoo , Gun-Woo Park , Seung-Hee Jung
- Applicant Address: KR Gyeonggi-Do
- Assignee: Ltrin. Co., Ltd.
- Current Assignee: Ltrin. Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Mayer & Williams PC
- Agent Stuart H. Mayer
- Priority: KR10-2010-0011642 20100208
- International Application: PCT/KR2010/008461 WO 20101126
- International Announcement: WO2011/096638 WO 20110811
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00 ; H01L21/677 ; H01L21/67

Abstract:
A substrate attachment system, including a portable chamber for receiving a pair of substrates which are aligned; a conveyor transportation device which continuously moves the portable chamber and to which a vacuum generator that is connected to a vacuum port of the portable chamber to evacuate the inside of the portable chamber is provided; and a heating device for performing a heating process in which the aligned substrates are attached to each other in the portable chamber, wherein the conveyor transportation device is arranged to pass through the heating device. The substrate attachment system may contribute to high attachment accuracy, and also, since the size of a chamber is reduced, a spatial utilization rate may be high, and also, since an attachment process is continuously performed by using a conveyor transportation device, a process time may be reduced.
Public/Granted literature
- US20120298306A1 SUBSTRATE BONDING SYSTEM AND MOBILE CHAMBER USED THERETO Public/Granted day:2012-11-29
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