公开(公告)号：US20120298306A1

公开(公告)日：2012-11-29

申请号：US13577458

申请日：2010-11-26

Applicant: Yong-Won Cha ,  Sang Wook Yoo ,  Gun-Woo Park ,  Seung-Hee Jung

Inventor： Yong-Won Cha ,  Sang Wook Yoo ,  Gun-Woo Park ,  Seung-Hee Jung

IPC: B32B37/10 ,  B32B37/06

CPC classification number: H01L21/6776 ,  H01L21/67092 ,  H01L21/6719

Abstract: A substrate attachment system, including a portable chamber for receiving a pair of substrates which are aligned; a conveyor transportation device which continuously moves the portable chamber and to which a vacuum generator that is connected to a vacuum port of the portable chamber to evacuate the inside of the portable chamber is provided; and a heating device for performing a heating process in which the aligned substrates are attached to each other in the portable chamber, wherein the conveyor transportation device is arranged to pass through the heating device. The substrate attachment system may contribute to high attachment accuracy, and also, since the size of a chamber is reduced, a spatial utilization rate may be high, and also, since an attachment process is continuously performed by using a conveyor transportation device, a process time may be reduced.

Abstract translation: 一种基板连接系统，包括用于接收对准的一对基板的便携式室; 提供了一种输送机输送装置，其连续地移动便携式室，并且提供连接到便携式室的真空端口以抽真空便携式室的内部的真空发生器。 以及用于进行加热处理的加热装置，其中对准的基板在便携式室中彼此附接，其中输送机输送装置布置成穿过加热装置。 衬底附着系统可以有助于高附着精度，并且由于室的尺寸减小，空间利用率可能高，并且由于通过使用输送机输送装置连续地执行附接过程，因此， 时间可能会减少。

公开(公告)号：US08999099B2

公开(公告)日：2015-04-07

申请号：US13577458

申请日：2010-11-26

Applicant: Yong-Won Cha ,  Sang Wook Yoo ,  Gun-Woo Park ,  Seung-Hee Jung

Inventor： Yong-Won Cha ,  Sang Wook Yoo ,  Gun-Woo Park ,  Seung-Hee Jung

IPC: B29C65/00 ,  B32B37/00 ,  H01L21/677 ,  H01L21/67

CPC classification number: H01L21/6776 ,  H01L21/67092 ,  H01L21/6719

Abstract: A substrate attachment system, including a portable chamber for receiving a pair of substrates which are aligned; a conveyor transportation device which continuously moves the portable chamber and to which a vacuum generator that is connected to a vacuum port of the portable chamber to evacuate the inside of the portable chamber is provided; and a heating device for performing a heating process in which the aligned substrates are attached to each other in the portable chamber, wherein the conveyor transportation device is arranged to pass through the heating device. The substrate attachment system may contribute to high attachment accuracy, and also, since the size of a chamber is reduced, a spatial utilization rate may be high, and also, since an attachment process is continuously performed by using a conveyor transportation device, a process time may be reduced.

Abstract translation: 一种基板连接系统，包括用于接收对准的一对基板的便携式室; 提供了一种输送机输送装置，其连续地移动便携式室，并且提供连接到便携式室的真空端口以抽真空便携式室的内部的真空发生器。 以及用于进行加热处理的加热装置，其中对准的基板在便携式室中彼此附接，其中输送机输送装置布置成穿过加热装置。 衬底附着系统可以有助于高附着精度，并且由于室的尺寸减小，空间利用率可能高，并且由于通过使用输送机输送装置连续地执行附接过程，因此， 时间可能会减少。

公开(公告)号：US20140322834A1

公开(公告)日：2014-10-30

申请号：US14263342

申请日：2014-04-28

Applicant: LTrin Co., Ltd

Inventor： Yong Won CHA ,  Chang Woo RYOO ,  Sang Jun OH ,  Gun Woo PARK ,  Jae In PARK

IPC: H01L21/66 ,  H01L21/68

CPC classification number: H01L21/681 ,  H01L21/67092

Abstract: An apparatus for bonding substrates and a method of bonding substrates are provided. In accordance with one exemplary embodiment of the present invention, a first plate to mount a first substrate is provided. A chamber body movably connected to the first plate is provided. A second plate that is placed opposite to the first plate and a second substrate is mounted on the second plate is provided. A chamber lead having the second plate mounted inside is provided which is movably connected to the chamber body to move rotationally or linearly to open or close the chamber space with the chamber body. A pair of first alignment cameras is placed outside of the chamber space to scan the first substrate or the second substrate. A stage control unit is provided to move the first plate or the second plate to align the first substrate and the second substrate.

Abstract translation: 提供一种用于接合衬底的装置和一种接合衬底的方法。 根据本发明的一个示例性实施例，提供了一种用于安装第一基板的第一板。 提供可移动地连接到第一板的室主体。 提供了与第一板相对放置的第二板和安装在第二板上的第二基板。 提供具有安装在内部的第二板的室引线，其可移动地连接到室主体以旋转或线性移动以利用室主体打开或关闭室空间。 一对第一对准摄像机放置在腔室空间的外部以扫描第一衬底或第二衬底。 提供舞台控制单元以移动第一板或第二板以对准第一衬底和第二衬底。

公开(公告)号：US08278186B2

公开(公告)日：2012-10-02

申请号：US12602285

申请日：2007-10-31

Applicant: Yong Won Cha ,  Dong Chul Kim

Inventor： Yong Won Cha ,  Dong Chul Kim

IPC: H01L21/30

CPC classification number: H01L21/02052 ,  H01L21/02046 ,  H01L21/02054 ,  H01L21/0206 ,  H01L21/187 ,  H01L21/76251

Abstract: The present invention relates to a wafer cleaning and a wafer bonding method using the same that can improve a yield of cleaning process and bonding property in bonding the cleaned wafer by cleaning the wafer using atmospheric pressure plasma and cleaning solution. The wafer cleaning method includes the steps of providing a process chamber with a wafer whose bonding surface faces upward, cleaning and surface-treating the bonding surface of the wafer by supplying atmospheric pressure plasma and a cleaning solution to the bonding surface of the wafer, and withdrawing out the wafer from the process chamber. The wafer bonding method includes the steps of: providing a first process chamber with a first wafer whose bonding surface faces upward; cleaning and surface-treating the bonding surface of the first wafer by supplying atmospheric pressure plasma and a cleaning solution to the bonding surface of the first wafer; withdrawing out the first wafer from the first process chamber and providing a second process chamber with the first wafer; providing a third process chamber with a second wafer whose bonding surface faces upward; cleaning and surface-treating the bonding surface of the second wafer by supplying atmospheric pressure plasma and a cleaning solution to the bonding surface of the second wafer; withdrawing out the second wafer from the third process chamber and providing the second process chamber with the second wafer whose bonding surface faces to the bonding surface of the first wafer and bonding the bonding surfaces of the first and second wafers to each other.

Abstract translation: 本发明涉及使用这种方法的晶片清洗和晶片接合方法，其可以通过使用大气压等离子体和清洁溶液清洁晶片来提高清洁工艺的产率和粘合清洁晶片的接合性能。 晶片清洗方法包括以下步骤：向处理室提供接合面朝上的晶片，通过向晶片的接合表面供给大气压等离子体和清洗溶液来清洁和表面处理晶片的接合表面;以及 从处理室中取出晶片。 晶片接合方法包括以下步骤：向第一处理室提供接合面朝上的第一晶片; 通过向第一晶片的接合表面供应大气压等离子体和清洁溶液来清洁和表面处理第一晶片的接合表面; 从第一处理室中取出第一晶片并且提供具有第一晶片的第二处理室; 提供具有接合表面朝上的第二晶片的第三处理室; 通过向第二晶片的接合表面供应大气压等离子体和清洁溶液来清洁和表面处理第二晶片的结合表面; 从第三处理室中取出第二晶片，并向第二处理室提供第二晶片，其第二晶片的键合表面面向第一晶片的结合表面，并将第一和第二晶片的结合表面彼此结合。