Invention Grant
- Patent Title: Method for fabricating a microarray of soft materials
- Patent Title (中): 软材料微阵列的制造方法
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Application No.: US13814588Application Date: 2012-03-27
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Publication No.: US08999443B2Publication Date: 2015-04-07
- Inventor: Satoshi Hiyama , Kaori Kuribayashi , Hiroaki Onoe , Shoji Takeuchi
- Applicant: Satoshi Hiyama , Kaori Kuribayashi , Hiroaki Onoe , Shoji Takeuchi
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: NTT DOCOMO, INC.,The University of Tokyo
- Current Assignee: NTT DOCOMO, INC.,The University of Tokyo
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-070934 20110328
- International Application: PCT/JP2012/057996 WO 20120327
- International Announcement: WO2012/133450 WO 20121004
- Main IPC: C23C16/00
- IPC: C23C16/00 ; B05D1/32 ; C12N15/09 ; G01N37/00 ; G01N33/543 ; B81C1/00

Abstract:
A method for fabricating a microarray of plural soft materials includes: vapor-depositing a first layer poly(para-xylylene) resin on a substrate, forming a first micro pattern in the poly(para-xylylene) resin; obtaining a substrate including a first microarray formed by pouring a first soft material solution, freeze-drying the first soft material to obtain a micro-arrayed substrate of the freeze-dried first soft material; vapor-depositing a second layer poly(para-xylylene) resin on the micro-arrayed substrate of the freeze-dried first soft material, forming a second micro pattern placed differently from the first micro pattern by penetrating the poly(para-xylylene) resin of the first and second layers, forming a second microarray on the substrate by pouring a second soft material solution; and forming a microarray of the first and second soft materials on the substrate by peeling off the poly(para-xylylene) resin of the first and second layers.
Public/Granted literature
- US20130136863A1 METHOD FOR FABRICATING A MICROARRAY OF SOFT MATERIALS Public/Granted day:2013-05-30
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