发明授权
- 专利标题： Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
- 专利标题（中）： 散热材料和发光二极管封装，包括由散热材料制成的接合部分
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申请号： US13213730申请日： 2011-08-19
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公开(公告)号： US09000473B2公开(公告)日： 2015-04-07
- 发明人: Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
- 申请人： Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
- 申请人地址： KR Gyeonggi-Do
- 专利权人： Samsung Electronics Co., Ltd
- 当前专利权人： Samsung Electronics Co., Ltd
- 当前专利权人地址： KR Gyeonggi-Do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2010-0081007 20100820
- 主分类号： H01L33/64
- IPC分类号： H01L33/64 ; H05K1/02 ; B23K35/26 ; C22C45/00 ; H05K3/00 ; H05K3/32 ; H05K3/34
摘要：
Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.