发明授权
- 专利标题： Integrated circuit package system with bonding in via
- 专利标题（中）： 集成电路封装系统，通孔接合
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申请号： US11694912申请日： 2007-03-30
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公开(公告)号： US09000579B2公开(公告)日： 2015-04-07
- 发明人: Il Kwon Shim , Dario S. Filoteo, Jr. , Emmanuel Espiritu , Rachel Layda Abinan
- 申请人： Il Kwon Shim , Dario S. Filoteo, Jr. , Emmanuel Espiritu , Rachel Layda Abinan
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L21/44 ; H01L23/498 ; H01L23/00
摘要：
An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening having a closed end at the bottom, attaching an integrated circuit die over the substrate, and connecting a die interconnect to the integrated circuit die and the closed end of the conductor.
公开/授权文献
- US20080237873A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING IN VIA 公开/授权日：2008-10-02
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