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公开(公告)号：US09000579B2
公开(公告)日：2015-04-07
申请号：US11694912
申请日：2007-03-30
IPC分类号： H01L23/48 , H01L23/52 , H01L21/44 , H01L23/498 , H01L23/00
CPC分类号： H01L23/49827 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/85186 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening having a closed end at the bottom, attaching an integrated circuit die over the substrate, and connecting a die interconnect to the integrated circuit die and the closed end of the conductor.
摘要翻译： 一种集成电路封装系统，包括其中设置有开口的基板，在该开口中形成在底部具有封闭端的导体，将集成电路裸片安装在基板上，并将芯片互连连接到集成电路管芯和封闭 导体末端。
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公开(公告)号：US08395254B2
公开(公告)日：2013-03-12
申请号：US11278008
申请日：2006-03-30
申请人： Emmanuel Espiritu , Dario S. Filoteo, Jr. , Leo A. Merilo , Philip Lyndon Cablao , Rachel Layda Abinan , Allan Ilagan
发明人： Emmanuel Espiritu , Dario S. Filoteo, Jr. , Leo A. Merilo , Philip Lyndon Cablao , Rachel Layda Abinan , Allan Ilagan
IPC分类号： H01L23/10
CPC分类号： H01L23/4334 , H01L21/565 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package system includes providing a substrate having an integrated circuit, attaching a heatspreader having a force control protrusion on the substrate, and forming an encapsulant over the heatspreader and the integrated circuit.
摘要翻译： 集成电路封装系统包括提供具有集成电路的基板，在基板上安装具有力控制突起的散热器，以及在散热器和集成电路上形成密封剂。
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3.发明授权Integrated circuit package system having interconnect stack and external interconnect 有权具有互连堆叠和外部互连的集成电路封装系统公开(公告)号：US08138080B2
公开(公告)日：2012-03-20
申请号：US11276716
申请日：2006-03-10
申请人： Dario S. Filoteo, Jr. , Leo A. Merilo , Philip Lyndon Cablao , Emmanuel Espiritu , Rachel Layda Abinan , Allan Ilagan
发明人： Dario S. Filoteo, Jr. , Leo A. Merilo , Philip Lyndon Cablao , Emmanuel Espiritu , Rachel Layda Abinan , Allan Ilagan
IPC分类号： H01L21/44
CPC分类号： H01L23/4952 , H01L23/3107 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/4848 , H01L2224/48997 , H01L2224/49113 , H01L2224/49425 , H01L2224/73265 , H01L2224/85043 , H01L2224/85045 , H01L2224/85051 , H01L2224/85205 , H01L2224/85399 , H01L2224/85951 , H01L2924/00014 , H01L2924/01082 , H01L2924/10161 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2924/00 , H01L2224/45099 , H01L2224/48455 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.
摘要翻译： 提供集成电路封装系统，其形成具有设置在其上的第一接合焊盘的集成电路管芯，在第一外部互连上形成互连堆叠，以及将互连堆叠连接到第一接合焊盘。
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公开(公告)号：US08026129B2
公开(公告)日：2011-09-27
申请号：US11276682
申请日：2006-03-10
申请人： Philip Lyndon Cablao , Dario S. Filoteo, Jr. , Leo A. Merilo , Emmanuel Espiritu , Rachel Layda Abinan , Allan Ilagan
发明人： Philip Lyndon Cablao , Dario S. Filoteo, Jr. , Leo A. Merilo , Emmanuel Espiritu , Rachel Layda Abinan , Allan Ilagan
IPC分类号： H01L21/00
CPC分类号： H01L25/162 , H01L23/49816 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06572 , H01L2225/06586 , H01L2225/06596 , H01L2924/14 , H01L2924/15311 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A stacked integrated circuit package system is provided forming a first stack layer having a first integrated circuit die on a first substrate, forming a second stack layer having a second integrated circuit die on a second substrate, and mechanically and electrically connecting a spacer layer having a first passive component between the second stack layer and the first stack layer.
摘要翻译： 提供一种堆叠式集成电路封装系统，其形成在第一衬底上具有第一集成电路裸片的第一堆叠层，在第二衬底上形成具有第二集成电路裸片的第二堆叠层，以及机械地和电连接具有 第二堆叠层和第一堆叠层之间的第一无源部件。
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公开(公告)号：US20080237873A1
公开(公告)日：2008-10-02
申请号：US11694912
申请日：2007-03-30
CPC分类号： H01L23/49827 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/85186 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening in the substrate open at the top and having a closed end at the bottom, attaching an integrated circuit die over the substrate, and connecting a die interconnect to the integrated circuit die and the closed end of the conductor.
摘要翻译： 一种集成电路封装系统，包括其中设置有开口的基板，在顶部开口的开口中形成导体，并在底部具有封闭端，将集成电路裸片安装在基板上，以及将芯片互连 到集成电路管芯和导体的封闭端。
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公开(公告)号：US07911046B2
公开(公告)日：2011-03-22
申请号：US12391807
申请日：2009-02-24
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L23/13 , H01L24/16 , H01L24/28 , H01L24/31 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/0652 , H01L25/162 , H01L2224/1134 , H01L2224/131 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/83102 , H01L2224/85201 , H01L2224/85205 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/0665 , H01L2924/014 , H01L2224/16225 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/16145 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有耦合槽的插入件，将上模固定在插入器上，将插入件安装在集成电路上，并通过耦合槽将集成电路耦合到上模。
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公开(公告)号：US20090152704A1
公开(公告)日：2009-06-18
申请号：US12391807
申请日：2009-02-24
CPC分类号： H01L24/83 , H01L23/13 , H01L24/16 , H01L24/28 , H01L24/31 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/0652 , H01L25/162 , H01L2224/1134 , H01L2224/131 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/83102 , H01L2224/85201 , H01L2224/85205 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/0665 , H01L2924/014 , H01L2224/16225 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/16145 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有耦合槽的插入件，将上模固定在插入器上，将插入件安装在集成电路上，并通过耦合槽将集成电路耦合到上模。
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公开(公告)号：US07518226B2
公开(公告)日：2009-04-14
申请号：US11671684
申请日：2007-02-06
IPC分类号： H01L23/538
CPC分类号： H01L24/83 , H01L23/13 , H01L24/16 , H01L24/28 , H01L24/31 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/0652 , H01L25/162 , H01L2224/1134 , H01L2224/131 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/83102 , H01L2224/85201 , H01L2224/85205 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/0665 , H01L2924/014 , H01L2224/16225 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/16145 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有耦合槽的插入件，将上模固定在插入器上，将插入件安装在集成电路上，并通过耦合槽将集成电路耦合到上模。
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公开(公告)号：US20080185719A1
公开(公告)日：2008-08-07
申请号：US11671684
申请日：2007-02-06
IPC分类号： H01L23/538 , H01L21/58
CPC分类号： H01L24/83 , H01L23/13 , H01L24/16 , H01L24/28 , H01L24/31 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/0652 , H01L25/162 , H01L2224/1134 , H01L2224/131 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/83102 , H01L2224/85201 , H01L2224/85205 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/0665 , H01L2924/014 , H01L2224/16225 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/16145 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有耦合槽的插入件，将上模固定在插入器上，将插入件安装在集成电路上，并通过耦合槽将集成电路耦合到上模。
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10.发明授权Integrated circuit packaging system with interconnects and method of manufacture thereof 有权具有互连的集成电路封装系统及其制造方法公开(公告)号：US08802555B2
公开(公告)日：2014-08-12
申请号：US13069980
申请日：2011-03-23
IPC分类号： H01L21/44
CPC分类号： H01L24/85 , H01L23/4952 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/32245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45139 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48724 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48799 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/73265 , H01L2224/78301 , H01L2224/83192 , H01L2224/85181 , H01L2224/85207 , H01L2224/85375 , H01L2224/85801 , H01L2224/8592 , H01L2224/92247 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00015 , H01L2924/00012 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a die paddle and a lead adjacent to the die paddle; mounting an integrated circuit, having a bond pad, over the die paddle; forming a bonding interconnect on the bond pad; attaching a circuit end of an internal interconnect to the bonding interconnect, the bonding interconnect between the circuit end and the bond pad; and connecting a lead end of the internal interconnect to the lead.
摘要翻译： 一种制造集成电路封装系统的方法包括：提供与所述管芯焊盘相邻的管芯焊盘和引线; 在芯片上安装具有接合焊盘的集成电路; 在所述接合焊盘上形成接合互连; 将内部互连的电路端附接到接合互连，电路端和接合焊盘之间的接合互连; 并将内部互连的引线端连接到引线。
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