A method for producing an optoelectronic assembly (12) is provided, in which an optoelectronic component (16) is arranged on a carrier (14). Electrical terminals of the optoelectronic component (16) are electrically coupled to electrical contacts of the carrier (14) corresponding thereto. A dummy body (20) is arranged on a first side of the optoelectronic component (16) facing away from the carrier (14). A potting material (22) is arranged on the carrier (14), which potting material at least partially encloses the optoelectronic component (16) and at least partially encloses the dummy body (20). The dummy body (20) is removed, after the potting material (22) is dimensionally stable, whereby a recess (23) results, which is at least partially enclosed by the dimensionally stable potting material (22). An optically functional material (24) is decanted into the recess (23).