Invention Grant
- Patent Title: Submount assembly integration
- Patent Title (中): 底座组装一体化
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Application No.: US13787405Application Date: 2013-03-06
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Publication No.: US09018737B2Publication Date: 2015-04-28
- Inventor: Lijuan Zhong , Edward Charles Gage
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: HolzerIPLaw, PC
- Main IPC: H01L23/44
- IPC: H01L23/44 ; H01S5/022
Abstract:
In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for integrating the laser with the submount.
Public/Granted literature
- US20140252560A1 SUBMOUNT ASSEMBLY INTEGRATION Public/Granted day:2014-09-11
Information query
IPC分类:
