High flow packaging for slider cleaning

    公开(公告)号:US10147448B2

    公开(公告)日:2018-12-04

    申请号:US14793260

    申请日:2015-07-07

    Abstract: A tray system for containing multiple electronic components that includes a first tray having a planar member and a plurality of pockets recessed into an upper surface of the planar member, wherein each of the pockets includes: a bottom surface; an aperture extending through the bottom surface; a supply channel extending from a lower surface of the planar member to the aperture; a plurality of wall segments extending from the bottom surface of the pocket to the upper surface of the planar member and defining a perimeter of the pocket; and a plurality of pedestals extending from the bottom surface of the pocket toward the upper surface of the first tray.

    ANTIREFLECTION COATING FOR SLIDER
    3.
    发明申请
    ANTIREFLECTION COATING FOR SLIDER 审中-公开
    防滑涂料

    公开(公告)号:US20130279310A1

    公开(公告)日:2013-10-24

    申请号:US13784617

    申请日:2013-03-04

    Abstract: In accordance with one embodiment, a method is disclosed that comprises disposing an antireflection material in juxtaposition with a top surface of a slider. In accordance with another embodiment, a method is disclosed that comprises disposing an antireflective material between a facet edge of a laser and an incident surface of a waveguide. In yet another embodiment, an apparatus is disclosed that comprises a slider and an antireflection material in juxtaposition with a top surface of the slider.

    Abstract translation: 根据一个实施例,公开了一种方法,其包括将防反射材料与滑块的顶表面并置布置。 根据另一个实施例,公开了一种方法,其包括在激光器的小面边缘与波导的入射表面之间设置抗反射材料。 在另一个实施例中,公开了一种装置,其包括与滑块的顶表面并置的滑块和防反射材料。

    Reusable attachment pads for slider mounting
    5.
    发明授权
    Reusable attachment pads for slider mounting 有权
    用于滑块安装的可重复使用的附件垫

    公开(公告)号:US08810966B1

    公开(公告)日:2014-08-19

    申请号:US13796518

    申请日:2013-03-12

    Inventor: Lijuan Zhong

    CPC classification number: G11B5/50 G11B5/4826

    Abstract: A slider for a disc drive assembly may be attached to various substrates during manufacture and installation in the disc drive assembly. In some examples, a slider attachment system includes a substrate, a first diffusion barrier layer formed over the substrate, a first solder-wettable protection layer formed over the first diffusion barrier layer, a second diffusion barrier layer formed over the first solder-wettable protection layer, and a second solder-wettable protection layer formed over the second diffusion barrier layer. The first and second solder-wettable protection layers may be formed of a material that is inert to a chemical etchant that can chemically dissolve the diffusion barrier layers. In use, solder may be applied to the second solder-wettable protection layer to wet and dissolve the layer. If the substrate needs to be detached and reattached, etchant can chemically dissolve the second diffusion barrier layer to expose the first solder-wettable layer for reattachment.

    Abstract translation: 用于盘驱动器组件的滑块可以在制造和安装在盘驱动器组件中时附接到各种基板。 在一些示例中,滑块附接系统包括基板,形成在基板上的第一扩散阻挡层,形成在第一扩散阻挡层上的第一可焊接润湿保护层,形成在第一可焊接润湿保护层上的第二扩散阻挡层 层,以及形成在第二扩散阻挡层上的第二可焊接润湿保护层。 第一和第二可焊接润湿保护层可以由对化学蚀刻剂具有惰性的材料形成,该材料可以化学溶解扩散阻挡层。 在使用中,可以将焊料施加到第二焊料可润湿保护层以使层湿润和溶解。 如果衬底需要分离并重新连接,则蚀刻剂可以化学地溶解第二扩散阻挡层以露出第一可焊接层以便重新附着。

    Submount assembly integration
    7.
    发明授权
    Submount assembly integration 有权
    底座组装一体化

    公开(公告)号:US09018737B2

    公开(公告)日:2015-04-28

    申请号:US13787405

    申请日:2013-03-06

    Abstract: In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for integrating the laser with the submount.

    Abstract translation: 根据一个实施例,公开了一种装置,其包括可操作以与作为激光基座组件的激光器集成的基座; 所述副安装座的预定部分被配置为与所述激光器接合; 位于所述基座的所述预定部分上的用于将所述激光与所述基座集成的接合焊盘。

    SUBMOUNT ASSEMBLY INTEGRATION
    9.
    发明申请
    SUBMOUNT ASSEMBLY INTEGRATION 有权
    SUBMOUNT装配整合

    公开(公告)号:US20140252560A1

    公开(公告)日:2014-09-11

    申请号:US13787405

    申请日:2013-03-06

    Abstract: In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for integrating the laser with the submount.

    Abstract translation: 根据一个实施例,公开了一种装置,其包括可操作以与作为激光基座组件的激光器集成的基座; 所述副安装座的预定部分被配置为与所述激光器接合; 位于所述基座的所述预定部分上的用于将所述激光与所述基座集成的接合焊盘。

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