发明授权
- 专利标题： Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film
- 专利标题（中）： 正型感光性树脂组合物，使用其制备的感光性树脂膜和包含感光性树脂膜的半导体装置
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申请号： US13303197申请日： 2011-11-23
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公开(公告)号： US09023559B2公开(公告)日： 2015-05-05
- 发明人: Jong-Hwa Lee , Hyun-Yong Cho , Mi-Ra Im , Hwan-Sung Cheon , Min-Kook Chung , Ji-Young Jeong , Myoung-Hwan Cha
- 申请人： Jong-Hwa Lee , Hyun-Yong Cho , Mi-Ra Im , Hwan-Sung Cheon , Min-Kook Chung , Ji-Young Jeong , Myoung-Hwan Cha
- 申请人地址： KR Gumi-si
- 专利权人： Cheil Industries Inc.
- 当前专利权人： Cheil Industries Inc.
- 当前专利权人地址： KR Gumi-si
- 代理机构： Additon, Higgins & Pendleton, P.A.
- 优先权： KR10-2010-0140593 20101231
- 主分类号： G03F7/023
- IPC分类号： G03F7/023 ; H01L23/29 ; G03F7/075
摘要：
Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.