Invention Grant
- Patent Title: Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components
- Patent Title (中): 具有热隔离区域的插入器配置,用于温度敏感的光电子部件
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Application No.: US14510654Application Date: 2014-10-09
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Publication No.: US09031107B2Publication Date: 2015-05-12
- Inventor: Kalpendu Shastri , Soham Pathak , Vipulkumar Patel , Bipin Dama , Kishor Desai
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson & Sheridan LLP
- Main IPC: H01S3/04
- IPC: H01S3/04 ; H01S5/00 ; H01S5/024 ; H01S5/022 ; H01S5/40

Abstract:
An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.
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