公开(公告)号：US09632335B2

公开(公告)日：2017-04-25

申请号：US15009483

申请日：2016-01-28

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Prakash Gothoskar

IPC: G02F1/025 ,  G02B6/132 ,  G02B6/136 ,  G02F1/225 ,  G02F1/01 ,  G02F1/015

CPC classification number: G02F1/025 ,  G02B6/132 ,  G02B6/136 ,  G02F1/011 ,  G02F1/2257 ,  G02F2001/0152

Abstract: An optical modulator may include a leftmost waveguide, a rightmost waveguide, and a dielectric layer disposed therebetween. In one embodiment, the waveguides may be disposed on the same plane. When a voltage potential is created between the rightmost and leftmost waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) structure that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. As opposed to a horizontal SISCAP structure where the dielectric layer is disposed between upper and lower waveguides, arranging the dielectric layer between waveguides disposed on the same plane results in a vertical SISCAP structure. In one embodiment, the leftmost and rightmost waveguide are both made from crystalline silicon.

公开(公告)号：US20160320563A1

公开(公告)日：2016-11-03

申请号：US15206752

申请日：2016-07-11

Applicant: Cisco Technology, Inc.

Inventor： Sean Anderson ,  Weizhuo Li ,  Vipulkumar Patel

IPC: G02B6/32 ,  G02B6/136 ,  G02B3/00 ,  G02B6/132

CPC classification number: G02B6/32 ,  G02B3/0087 ,  G02B6/124 ,  G02B6/1245 ,  G02B6/132 ,  G02B6/136 ,  G02B6/30 ,  G02B6/4206 ,  G02B2006/12095 ,  G02B2006/121 ,  G02B2006/12176 ,  G02B2006/12178 ,  G02B2006/12195

Abstract: An optical coupling may involve orienting a waveguide and a lens such that light rays are focused on a surface. The lens may involve the use of a material having a variable refractive index to focus rays of light along first axis and a curved surface to focus the rays of light along a second axis.

公开(公告)号：US09360688B2

公开(公告)日：2016-06-07

申请号：US14263389

申请日：2014-04-28

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Prakash Gothoskar ,  Sean Anderson

IPC: G02F1/025 ,  G02F1/01 ,  G02F1/225 ,  B82Y20/00 ,  G02F1/21

CPC classification number: G02F1/025 ,  G02B6/132 ,  G02B6/136 ,  G02F1/011 ,  G02F1/2257 ,  G02F2001/0152

Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. In one embodiment, the lower waveguide may include a u-shaped region within an optical mode of the light passing through the optical modulator. By conforming the dielectric layer to the surfaces of the u-shaped region, the amount of area of the dielectric layer within a charge modulation region is increased relative to forming the dielectric layer on a single plane. Folding the dielectric layer in this manner may improve modulation efficiency. In one embodiment, the u-shaped region is formed by using ridge structures that extend from an upper surface of the lower waveguide towards the upper waveguide. To aid in lateral confinement of the optical mode, the dielectric layer may be deposited on one side surface of the ridge structures while a different dielectric material is deposited on the opposite side surface.

Abstract translation: 光调制器可以包括下波导，上波导和介于其间的电介质层。 在一个实施例中，下波导可以包括通过光调制器的光的光学模式内的u形区域。 通过使介电层与U形区域的表面相一致，相对于在单个平面上形成电介质层，电荷调制区域内的电介质层的面积增加。 以这种方式折叠介电层可以提高调制效率。 在一个实施例中，通过使用从下波导的上表面向上波导延伸的脊结构形成U形区域。 为了有助于光学模式的横向限制，介电层可以沉积在脊结构的一个侧表面上，而不同的电介质材料沉积在相对的侧表面上。

公开(公告)号：US20150277068A1

公开(公告)日：2015-10-01

申请号：US14687119

申请日：2015-04-15

Applicant: Cisco Technology, Inc.

Inventor： Kishor DESAI ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

IPC: G02B6/42 ,  G02B6/13

CPC classification number: G02B6/4255 ,  G02B6/12 ,  G02B6/13 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4292 ,  G02B6/43 ,  H01L21/50 ,  H01L23/04 ,  H01L23/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/52 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/165 ,  H01L2924/16788 ,  H05K1/0268 ,  H05K1/0274 ,  H05K2201/10121 ,  H01L2924/0105 ,  H01L2924/01079

Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

公开(公告)号：US20150023631A1

公开(公告)日：2015-01-22

申请号：US13945134

申请日：2013-07-18

Applicant: Cisco Technology, Inc

Inventor： Kalpendu Shastri ,  Ravi Sekhar Tummidi ,  Vipulkumar Patel

IPC: G02B6/12

CPC classification number: G02B6/46 ,  B32B37/16 ,  B32B38/0004 ,  B32B38/0012 ,  B32B38/10 ,  B32B2038/0016 ,  B32B2307/202 ,  B32B2307/40 ,  G02B6/12 ,  G02B6/2826 ,  G02B6/30 ,  Y10T156/1052

Abstract: An optical coupler may include a fiber optic structure that has a portion of an outer surface that is beveled at a predetermined angle relative to a longitudinal axis of the fiber optic structure. The beveled outer surface portion may be optically coupled with a waveguide core of an optical integrated circuit. The fiber optic structure may also include a second outer surface portion that is butt coupled to an end of an optical fiber to optically couple the second outer surface portion with the optical fiber.

Abstract translation: 光耦合器可以包括光纤结构，其具有相对于光纤结构的纵向轴线以预定角度倾斜的外表面的一部分。 斜面外表面部分可以与光学集成电路的波导芯光学耦合。 光纤结构还可以包括第二外表面部分，其与光纤的端部对接，以将第二外表面部分与光纤光学耦合。

公开(公告)号：US08876410B2

公开(公告)日：2014-11-04

申请号：US13737080

申请日：2013-01-09

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu Shastri ,  Soham Pathak ,  Utpal Chakrabarti ,  Vipulkumar Patel ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

IPC: G02B6/00 ,  G02B6/36 ,  G02B6/42

CPC classification number: G02B6/4292 ,  B82Y20/00 ,  C03C15/00 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4259 ,  Y10T29/4978

Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.

Abstract translation: 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中，透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。

公开(公告)号：US11886056B2

公开(公告)日：2024-01-30

申请号：US17456468

申请日：2021-11-24

Applicant: Cisco Technology, Inc.

Inventor： Donald Adams ,  Prakash B. Gothoskar ,  Vipulkumar Patel ,  Mark Webster

IPC: G02F1/025 ,  G02F1/01 ,  G02B6/132 ,  G02B6/136 ,  G02F1/225 ,  G02F1/015

CPC classification number: G02F1/025 ,  G02B6/132 ,  G02B6/136 ,  G02F1/011 ,  G02F1/2257 ,  G02F1/0152

Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.

公开(公告)号：US11067747B2

公开(公告)日：2021-07-20

申请号：US15662639

申请日：2017-07-28

Applicant: Cisco Technology, Inc.

Inventor： Sean P. Anderson ,  Vipulkumar Patel

IPC: G02B6/12 ,  G02B6/122 ,  H01L31/105 ,  H01L31/0232

Abstract: Embodiments herein describe optical interposers that utilize waveguides to detect light. For example, in one embodiment, an apparatus is provided that includes an optical detector having a first layer. The first layer includes at least one of polysilicon or amorphous silicon. The first layer forms a diode that includes a p-doped region and an n-doped region. The apparatus further includes a waveguide optically coupled to the diode and disposed on a different layer than the first layer.

公开(公告)号：US10734788B2

公开(公告)日：2020-08-04

申请号：US15910345

申请日：2018-03-02

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. Siriani ,  Sean P. Anderson ,  Vipulkumar Patel

IPC: H01S5/343 ,  H01S5/02 ,  H01L21/68 ,  H01S5/34 ,  H01L21/02 ,  H01S5/022 ,  B82Y20/00 ,  H01S5/042 ,  H01S5/125 ,  H01S5/22 ,  H01S5/10

Abstract: A wafer comprising: a silicon substrate; a base layer of a predetermined thickness of a III-V semiconductor material bonded with the silicon substrate; and at least one layer grown on the base layer to form a plurality of quantum dot lasers.

公开(公告)号：US10705313B2

公开(公告)日：2020-07-07

申请号：US15904038

申请日：2018-02-23

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Sean P. Anderson ,  Weizhuo Li

IPC: G02B9/04 ,  G02B6/26 ,  G02B6/10

Abstract: A system and related method and assembly are disclosed. The system comprises one or more optical fibers configured to propagate one or more optical signals. The system further comprises at least a first cylindrical lens element fixedly connected with the one or more optical fibers and configured to expand the one or more optical signals along a predefined dimension. The system further comprises at least a second cylindrical lens element optically coupled with the first cylindrical lens element and configured to condense the expanded one or more optical signals along the predefined dimension.