Invention Grant
- Patent Title: Apparatus and methods for quad flat no lead packaging
- Patent Title (中): 四边形无铅封装的设备和方法
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Application No.: US13182710Application Date: 2011-07-14
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Publication No.: US09034697B2Publication Date: 2015-05-19
- Inventor: Zhiwei Gong , Jianwen Xu , Wei Gao , Scott M. Hayes
- Applicant: Zhiwei Gong , Jianwen Xu , Wei Gao , Scott M. Hayes
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L21/56 ; H01L23/495 ; H01L21/48 ; H01L23/00 ; H01L23/31
Abstract:
A method for fabricating a semiconductor package is disclosed that includes providing a supply of lead elements, mounting a plurality of the lead elements on a lead frame until a predetermined number of lead elements are placed on the lead frame, and connecting other components on the lead frame to the lead elements.
Public/Granted literature
- US20130015566A1 APPARATUS AND METHODS FOR QUAD FLAT NO LEAD PACKAGING Public/Granted day:2013-01-17
Information query
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