发明授权
- 专利标题： Apparatus and methods for quad flat no lead packaging
- 专利标题（中）： 四边形无铅封装的设备和方法
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申请号： US13182710申请日： 2011-07-14
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公开(公告)号： US09034697B2公开(公告)日： 2015-05-19
- 发明人: Zhiwei Gong , Jianwen Xu , Wei Gao , Scott M. Hayes
- 申请人： Zhiwei Gong , Jianwen Xu , Wei Gao , Scott M. Hayes
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/56 ; H01L23/495 ; H01L21/48 ; H01L23/00 ; H01L23/31
摘要：
A method for fabricating a semiconductor package is disclosed that includes providing a supply of lead elements, mounting a plurality of the lead elements on a lead frame until a predetermined number of lead elements are placed on the lead frame, and connecting other components on the lead frame to the lead elements.
公开/授权文献
- US20130015566A1 APPARATUS AND METHODS FOR QUAD FLAT NO LEAD PACKAGING 公开/授权日：2013-01-17