发明授权
- 专利标题: High density multi-chip LED devices
- 专利标题(中): 高密度多芯片LED器件
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申请号: US13017502申请日: 2011-01-31
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公开(公告)号: US09041042B2公开(公告)日: 2015-05-26
- 发明人: Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Amber C. Abare , Jeffrey C. Britt
- 申请人: Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Amber C. Abare , Jeffrey C. Britt
- 申请人地址: US NC Durham
- 专利权人: Cree, Inc.
- 当前专利权人: Cree, Inc.
- 当前专利权人地址: US NC Durham
- 代理机构: Moore & Van Allen PLLC
- 代理商 Steven B. Phillips
- 主分类号: H01L33/62
- IPC分类号: H01L33/62 ; H01L25/075 ; H01L33/58
摘要:
High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
公开/授权文献
- US08896013B2 High density multi-chip LED devices 公开/授权日:2014-11-25