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公开(公告)号：US09627361B2
公开(公告)日：2017-04-18
申请号：US13017575
申请日：2011-01-31
IPC分类号： H01L29/18 , H01L25/075 , H01L33/58 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.
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2.发明授权公开(公告)号：US09159888B2
公开(公告)日：2015-10-13
申请号：US11899790
申请日：2007-09-07
申请人： Ashay Chitnis , James Ibbetson , Bernd Keller , David T. Emerson , John Edmond , Michael J. Bergmann , Jasper S. Cabalu , Jeffrey C. Britt , Arpan Chakraborty , Eric Tarsa , Yankun Fu
发明人： Ashay Chitnis , James Ibbetson , Bernd Keller , David T. Emerson , John Edmond , Michael J. Bergmann , Jasper S. Cabalu , Jeffrey C. Britt , Arpan Chakraborty , Eric Tarsa , James Seruto , Yankun Fu
CPC分类号： H01L33/508 , H01L33/0095 , H01L33/36 , H01L33/387 , H01L33/44 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
摘要翻译： 制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。 基座沉积在LED上，每个基座与其中一个LED电接触。 在LED上形成涂层，其中涂层埋入至少一些基座。 然后将涂层平坦化以暴露至少一些埋置的基座，同时在所述LED上留下至少一些所述涂层。 然后可以例如通过引线接合露出的基座。 本发明公开了用于制造LED芯片的类似方法，所述LED芯片具有倒装芯片接合在载体基板上并用于制造其它半导体器件的LED。 还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。
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公开(公告)号：USD660257S1
公开(公告)日：2012-05-22
申请号：US29384363
申请日：2011-01-31
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公开(公告)号：US20120127720A1
公开(公告)日：2012-05-24
申请号：US13227961
申请日：2011-09-08
CPC分类号： H01L27/153 , H01L25/0753 , H01L25/167 , H01L33/08 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/49113 , H01L2924/12032 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
摘要： Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components.
摘要翻译： 公开了用于较高电压应用的发光器件和诸如发光二极管（LED）的方法。 这里公开了LED的可变布置。 布置可以包括串联，并联和/或其组合的一个或多个LED芯片。 LED芯片可以设置在具有至少一个热元件和一个或多个电气部件的封装主体中。
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公开(公告)号：USD658139S1
公开(公告)日：2012-04-24
申请号：US29384360
申请日：2011-01-31
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公开(公告)号：US20120069564A1
公开(公告)日：2012-03-22
申请号：US13017407
申请日：2011-01-31
申请人： Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Jeffrey C. Britt
发明人： Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Jeffrey C. Britt
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , Y10T29/49002 , H01L2924/00014
摘要： Multi-chip LED devices are described. Embodiments of the present invention provide multi-chip LED devices with relatively high efficiency and good color rendering. The LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The optical element may be molded from silicone. The LED chips may be connected in parallel. In some embodiments, the LED device includes a submount, which may be made of a ceramic material such as alumina or aluminum nitride. Wire bonds can be connected to the LED chips so that all the wire bonds tend the outside of a group of LED chips. Various sizes and types of LED chips may be used, including vertical LED chips and sideview LED chips.
摘要翻译： 描述了多芯片LED器件。 本发明的实施例提供了具有较高效率和良好显色性能的多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 光学元件可以由硅树脂模制而成。 LED芯片可以并联连接。 在一些实施例中，LED装置包括底座，其可由诸如氧化铝或氮化铝的陶瓷材料制成。 引线键可以连接到LED芯片，使得所有的引线键都趋向于一组LED芯片的外部。 可以使用各种尺寸和类型的LED芯片，包括垂直LED芯片和侧视LED芯片。
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公开(公告)号：US10008637B2
公开(公告)日：2018-06-26
申请号：US13312518
申请日：2011-12-06
CPC分类号： H01L33/486 , H01L33/20 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： Light emitter devices and methods with reduced dimensions and improved light output are provided. In one embodiment, a light emitter device includes a submount having an area of approximately 6 square millimeters (mm2) or less. The device can further include a light emitting chip on the submount and a lens disposed over the light emitting chip and positioned on the submount. The device can be operable for emitting light at approximately 100 lumens or higher.
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公开(公告)号：US09041042B2
公开(公告)日：2015-05-26
申请号：US13017502
申请日：2011-01-31
申请人： Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Amber C. Abare , Jeffrey C. Britt
发明人： Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Amber C. Abare , Jeffrey C. Britt
IPC分类号： H01L33/62 , H01L25/075 , H01L33/58
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , Y10T29/49002 , H01L2924/00014
摘要： High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
摘要翻译： 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。
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公开(公告)号：US08696159B2
公开(公告)日：2014-04-15
申请号：US13017407
申请日：2011-01-31
申请人： Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Jeffrey C. Britt
发明人： Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Jeffrey C. Britt
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , Y10T29/49002 , H01L2924/00014
摘要： Multi-chip LED devices are described. Embodiments of the present invention provide multi-chip LED devices with relatively high efficiency and good color rendering. The LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The optical element may be molded from silicone. The LED chips may be connected in parallel. In some embodiments, the LED device includes a submount, which may be made of a ceramic material such as alumina or aluminum nitride. Wire bonds can be connected to the LED chips so that all the wire bonds tend the outside of a group of LED chips. Various sizes and types of LED chips may be used, including vertical LED chips and sideview LED chips.
摘要翻译： 描述了多芯片LED器件。 本发明的实施例提供了具有较高效率和良好显色性能的多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 光学元件可以由硅树脂模制而成。 LED芯片可以并联连接。 在一些实施例中，LED装置包括底座，其可由诸如氧化铝或氮化铝的陶瓷材料制成。 引线键可以连接到LED芯片，使得所有的引线键都趋向于一组LED芯片的外部。 可以使用各种尺寸和类型的LED芯片，包括垂直LED芯片和侧视LED芯片。
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公开(公告)号：US20120086024A1
公开(公告)日：2012-04-12
申请号：US13017575
申请日：2011-01-31
CPC分类号： H01L25/0753 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.
摘要翻译： 公开了多配置发光二极管（LED）器件和方法，其中器件内的LED可以选择性地配置为用于更高电压或可变电压应用中。 可以配置LED的可变布置。 布置可以包括串联，并联和/或其组合的一个或多个LED。 可以安装一个或多个LED的表面可以包括一个或多个电隔离部分和/或热隔离部分。
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