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    High density multi-chip LED devices
    2.
    发明授权
    High density multi-chip LED devices 有权
    高密度多芯片LED器件

    公开(公告)号：US09041042B2

    公开(公告)日：2015-05-26

    申请号：US13017502

    申请日：2011-01-31

    申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/58

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

    摘要翻译： 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。

    Multi-chip LED devices
    3.
    发明授权
    Multi-chip LED devices 有权
    多芯片LED器件

    公开(公告)号：US08696159B2

    公开(公告)日：2014-04-15

    申请号：US13017407

    申请日：2011-01-31

    申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Jeffrey C. Britt

    发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Jeffrey C. Britt

    IPC分类号： F21V23/00 ,  H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： Multi-chip LED devices are described. Embodiments of the present invention provide multi-chip LED devices with relatively high efficiency and good color rendering. The LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The optical element may be molded from silicone. The LED chips may be connected in parallel. In some embodiments, the LED device includes a submount, which may be made of a ceramic material such as alumina or aluminum nitride. Wire bonds can be connected to the LED chips so that all the wire bonds tend the outside of a group of LED chips. Various sizes and types of LED chips may be used, including vertical LED chips and sideview LED chips.

    摘要翻译： 描述了多芯片LED器件。 本发明的实施例提供了具有较高效率和良好显色性能的多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 光学元件可以由硅树脂模制而成。 LED芯片可以并联连接。 在一些实施例中，LED装置包括底座，其可由诸如氧化铝或氮化铝的陶瓷材料制成。 引线键可以连接到LED芯片，使得所有的引线键都趋向于一组LED芯片的外部。 可以使用各种尺寸和类型的LED芯片，包括垂直LED芯片和侧视LED芯片。

    HIGH DENSITY MULTI-CHIP LED DEVICES
    5.
    发明申请
    HIGH DENSITY MULTI-CHIP LED DEVICES 有权
    高密度多芯片LED器件

    公开(公告)号：US20120068198A1

    公开(公告)日：2012-03-22

    申请号：US13017502

    申请日：2011-01-31

    申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    IPC分类号： H01L33/58

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

    摘要翻译： 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。

    Integrally bonded, multilayer foamed product
    7.
    发明授权
    Integrally bonded, multilayer foamed product 有权
    整体粘合，多层发泡产品

    公开(公告)号：US6054078A

    公开(公告)日：2000-04-25

    申请号：US170605

    申请日：1998-10-13

    申请人： Eduardo Lauer ,  Michael P. Laughner ,  Michael W. Allman

    发明人： Eduardo Lauer ,  Michael P. Laughner ,  Michael W. Allman

    IPC分类号： B29C44/04 ,  B29C44/56 ,  B29C47/02 ,  B29C47/28 ,  B32B1/08 ,  B32B5/18 ,  B29C44/24

    CPC分类号： B29C47/28 ,  B29C44/0461 ,  B29C44/569 ,  B29C47/0016 ,  B29C47/0023 ,  B29C47/021 ,  B29C47/025 ,  B32B1/08 ,  B32B5/18 ,  Y10T428/233 ,  Y10T428/239

    摘要： By employing a unique manufacturing process, unique manufacturing equipment, or a unique combination of materials, a fully integrated, multilayer foamed thermoplastic or elastomeric member or profile having a core member peripherally surrounded by an outer protective layer is attained which is virtually incapable of being removed from said core member. By effectively melting the adjacent surfaces of the foamed layers being interengaged, a core member having any desired cross-sectional shape is produced and is peripherally surrounded with an outer layer integrally bonded thereto. In one aspect of the present invention, metallocene catalyzed plastic material is employed in forming the core member to impart desirable physical attributes thereto. In an alternate aspect of the present invention, a manufacturing method or processing equipment are employed for assuring the integral bonded engagement of the outer protective layer to the core member, on a mass produced basis, which assures secure, affixed, bonded interengagement of the protective layer to the core member.

    摘要翻译： 通过采用独特的制造工艺，独特的制造设备或独特的材料组合，实现了完全集成的多层发泡热塑性或弹性体构件或轮廓，其具有外围被外部保护层周围包围的芯构件，其几乎不能被移除 从核心成员。 通过有效地熔化相互接合的发泡层的相邻表面，产生具有任何所需横截面形状的芯构件，并且周边地被与其整体结合的外层包围。 在本发明的一个方面，茂金属催化的塑料材料用于形成芯构件以赋予其理想的物理特性。 在本发明的另一方面，采用制造方法或加工设备来确保外部保护层与核心部件的整体结合，大量生产的基础上，确保了安全，固定，粘合的保护 层到核心成员。

    Light emitting devices including multiple anodes and cathodes
    9.
    发明授权
    Light emitting devices including multiple anodes and cathodes 有权
    包括多个阳极和阴极的发光器件

    公开(公告)号：US09515055B2

    公开(公告)日：2016-12-06

    申请号：US13471164

    申请日：2012-05-14

    申请人： Jeffrey Carl Britt ,  Michael P. Laughner

    发明人： Jeffrey Carl Britt ,  Michael P. Laughner ,  Brandon Stanton

    IPC分类号： F21V9/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Solid state (e.g., LED) lighting devices include multiple emitters mounted on or over a substrate comprising insulating material with conductive traces thereon, with various emitters being independently controllable with multiple pairs of anodes and cathodes that may be arranged on an opposite surface of the substrate than the emitters. Electrically conductive vias may be defined through the insulating substrate, and a molded lens may be provided over the substrate and emitters mounted thereon. Various combinations of independently controllable emitters or emitter groups may be provided, for example, a red emitter in combination with multiple blue shifted yellow (BSY) emitters, or separately controllable red, green, blue, and white (e.g., BSY) emitters.

    摘要翻译： 固态（例如，LED）照明装置包括安装在基板上或上方的多个发射器，其包括其上具有导电迹线的绝缘材料，其中各种发射器可独立地由多对阳极和阴极控制，所述多对阳极和阴极可布置在衬底的相对表面上 比排放者。 可以通过绝缘基板限定导电通孔，并且可以在基板上设置模制透镜并且安装在其上的发射器。 可以提供可独立控制的发射器或发射极组的各种组合，例如，与多个蓝色偏移的黄色（BSY）发射器或单独可控的红色，绿色，蓝色和白色（例如BSY）发射器组合的红色发射器。

    LIGHT EMITTING DEVICES INCLUDING MULTIPLE ANODES AND CATHODES
    10.
    发明申请
    LIGHT EMITTING DEVICES INCLUDING MULTIPLE ANODES AND CATHODES 有权
    发光装置，包括多个阳极和阴极

    公开(公告)号：US20130301257A1

    公开(公告)日：2013-11-14

    申请号：US13471164

    申请日：2012-05-14

    申请人： Jeffrey Carl Britt ,  Michael P. Laughner ,  Brandon Stanton

    发明人： Jeffrey Carl Britt ,  Michael P. Laughner ,  Brandon Stanton

    IPC分类号： F21V9/00 ,  F21V5/04 ,  F21V21/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Solid state (e.g., LED) lighting devices include multiple emitters mounted on or over a substrate comprising insulating material with conductive traces thereon, with various emitters being independently controllable with multiple pairs of anodes and cathodes that may be arranged on an opposite surface of the substrate than the emitters. Electrically conductive vias may be defined through the insulating substrate, and a molded lens may be provided over the substrate and emitters mounted thereon. Various combinations of independently controllable emitters or emitter groups may be provided, for example, a red emitter in combination with multiple blue shifted yellow (BSY) emitters, or separately controllable red, green, blue, and white (e.g., BSY) emitters.

    摘要翻译： 固态（例如，LED）照明装置包括安装在基板上或上方的多个发射器，其包括其上具有导电迹线的绝缘材料，其中各种发射器可独立地由多对阳极和阴极控制，所述多对阳极和阴极可布置在衬底的相对表面上 比排放者。 可以通过绝缘基板限定导电通孔，并且可以在基板上设置模制透镜并且安装在其上的发射器。 可以提供可独立控制的发射器或发射极组的各种组合，例如，与多个蓝色偏移的黄色（BSY）发射器或单独可控的红色，绿色，蓝色和白色（例如BSY）发射器组合的红色发射器。