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公开(公告)号：US09627361B2
公开(公告)日：2017-04-18
申请号：US13017575
申请日：2011-01-31
Applicant: Peter S. Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Jeffrey C. Britt
Inventor： Peter S. Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Jeffrey C. Britt
IPC: H01L29/18 , H01L25/075 , H01L33/58 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
Abstract: Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.
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2.发明授权公开(公告)号：US09159888B2
公开(公告)日：2015-10-13
申请号：US11899790
申请日：2007-09-07
Applicant: Ashay Chitnis , James Ibbetson , Bernd Keller , David T. Emerson , John Edmond , Michael J. Bergmann , Jasper S. Cabalu , Jeffrey C. Britt , Arpan Chakraborty , Eric Tarsa , Yankun Fu
Inventor： Ashay Chitnis , James Ibbetson , Bernd Keller , David T. Emerson , John Edmond , Michael J. Bergmann , Jasper S. Cabalu , Jeffrey C. Britt , Arpan Chakraborty , Eric Tarsa , James Seruto , Yankun Fu
CPC classification number: H01L33/508 , H01L33/0095 , H01L33/36 , H01L33/387 , H01L33/44 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
Abstract translation: 制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。 基座沉积在LED上，每个基座与其中一个LED电接触。 在LED上形成涂层，其中涂层埋入至少一些基座。 然后将涂层平坦化以暴露至少一些埋置的基座，同时在所述LED上留下至少一些所述涂层。 然后可以例如通过引线接合露出的基座。 本发明公开了用于制造LED芯片的类似方法，所述LED芯片具有倒装芯片接合在载体基板上并用于制造其它半导体器件的LED。 还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。
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公开(公告)号：US09035328B2
公开(公告)日：2015-05-19
申请号：US13021496
申请日：2011-02-04
Applicant: Theodore D. Lowes , Eric J. Tarsa , Bernd P. Keller , David T. Emerson
Inventor： Theodore D. Lowes , Eric J. Tarsa , Bernd P. Keller , David T. Emerson
CPC classification number: G09F9/33 , G09F9/3026 , H01L25/0753 , H01L33/54 , H01L2924/0002 , H01L2924/00
Abstract: An LED component includes, according to a first embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an optical lens overlying the LED chips and having a lens base attached to the substrate, where the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The LED component includes, according to a second embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an array of optical lenses, each optical lens overlying at least one of the LED chips and having a lens base attached to the substrate, where at least one of the LED chips is positioned to provide a peak emission shifted from a perpendicular centerline of the respective lens base.
Abstract translation: 根据第一实施例，LED组件包括单片基板，设置在基板的表面上的LED芯片的阵列以及覆盖LED芯片并且具有附接到基板的透镜基板的光学透镜，其中LED芯片 定位成提供从透镜基座的垂直中心线偏移的峰值发射。 根据第二实施例，LED组件包括单片基板，设置在基板的表面上的LED芯片阵列和光学透镜阵列，每个光学透镜覆盖至少一个LED芯片并具有透镜 基底，其中至少一个LED芯片被定位成提供从相应透镜基底的垂直中心线偏移的峰值发射。
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公开(公告)号：US08766298B2
公开(公告)日：2014-07-01
申请号：US13040088
申请日：2011-03-03
Applicant: Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
Inventor： Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
CPC classification number: H01L33/54 , H01L33/486 , H01L33/50 , H01L33/60 , H01L2224/48091 , H01L2224/48465 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting packaged diode ids disclosed that includes a light emitting diode mounted in a reflective package in which the surfaces adjacent the diode are near Lambertian reflectors. An encapsulant in the package is bordered by the Lambertian reflectors and a phosphor in the encapsulant converts frequencies emitted by the LED chip and, together with the frequencies emitted by the LED chip, produces white light. A substantially flat meniscus formed by the encapsulant defines the emitting surface of the packaged diode.
Abstract translation: 公开了一种发光封装二极管，其包括安装在反射封装中的发光二极管，其中与二极管相邻的表面靠近朗伯反射器。 包装中的密封剂由朗伯反射器界定，并且密封剂中的磷光体转换由LED芯片发射的频率，并且与LED芯片发射的频率一起产生白光。 由密封剂形成的基本平坦的弯液面限定了封装二极管的发射表面。
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公开(公告)号：US08624271B2
公开(公告)日：2014-01-07
申请号：US13104558
申请日：2011-05-10
Applicant: Jesse Colin Reiherzer , Christopher P. Hussell , Peter Scott Andrews , David T. Emerson
IPC: H01L33/62
CPC classification number: H01L33/08 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底和布置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。
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Patent Agency Ranking
公开(公告)号：US08425271B2
公开(公告)日：2013-04-23
申请号：US11839562
申请日：2007-08-16
Applicant: Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
Inventor： Christopher P. Hussell , Michael J. Bergmann , Brian T. Collins , David T. Emerson
CPC classification number: H01L33/60 , H01L33/486 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
Abstract: A method of forming an LED lamp with a desired distribution of phosphor is disclosed. The method includes the steps of mixing a plurality of phosphor particles in an uncured polymer resin for which the viscosity can be controlled in response to temperature to form a substantially uniform suspension of the phosphor particles in the resin. The uncured resin is then placed into a defined position adjacent an LED chip and the temperature of the resin is increased to correspondingly decrease its viscosity but to less than the temperature at which the resin would cure unreasonably quickly. The phosphor particles are encouraged to settle in the lowered-viscosity resin to a desired position with respect to the LED chip, and the temperature of the resin is thereafter increased to the point at which it will cured and solidify.
Abstract translation: 公开了一种形成具有所需分布的荧光体的LED灯的方法。 该方法包括以下步骤：在未固化的聚合物树脂中混合多个荧光体颗粒，根据温度可以控制粘度，以形成荧光体颗粒在树脂中的基本上均匀的悬浮液。 然后将未固化的树脂放置在与LED芯片相邻的限定位置，并且增加树脂的温度以相应地降低其粘度，但是小于树脂不合理地固化的温度。 鼓励荧光体颗粒将低粘度树脂沉降到相对于LED芯片的期望位置，然后将树脂的温度升高至其固化和固化的程度。
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公开(公告)号：US20120153317A1
公开(公告)日：2012-06-21
申请号：US13011609
申请日：2011-01-21
Applicant: David T. Emerson , Michael J. Bergmann , Christopher P. Hussell
Inventor： David T. Emerson , Michael J. Bergmann , Christopher P. Hussell
CPC classification number: H01L25/0753 , G02F1/133603 , G02F1/133608 , H01L24/48 , H01L24/49 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/29144 , H01L2224/2929 , H01L2224/29399 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/83192 , H01L2224/92247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/10157 , H01L2924/10158 , H01L2924/12032 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/0105 , H01L2924/0665 , H01L2224/45099 , H01L2924/00
Abstract: Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.
Abstract translation: 公开了发光二极管（LED）装置，系统和方法。 一方面，照明面板可以被配置为为液晶显示器（LCD）面板提供背光。 照明面板可以包括以阵列布置的一个或多个LED。 一个或多个LED可以使用金属对金属管芯附接方法安装在照明面板上，或者附接在设置在照明面板上的封装内。 在一个方面，可以使用本文公开的鲁棒金属 - 金属管芯附接技术和/或材料来连接一个或多个LED。
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公开(公告)号：USD660257S1
公开(公告)日：2012-05-22
申请号：US29384363
申请日：2011-01-31
Applicant: Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Jeffrey C. Britt
Designer： Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Jeffrey C. Britt
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公开(公告)号：US20100244052A1
公开(公告)日：2010-09-30
申请号：US12796365
申请日：2010-06-08
Applicant: John Adam Edmond , Michael J. Bergmann , David T. Emerson , Kevin Ward Haberern
Inventor： John Adam Edmond , Michael J. Bergmann , David T. Emerson , Kevin Ward Haberern
CPC classification number: H01L33/32 , H01L33/007 , H01L33/325
Abstract: A light emitting diode is disclosed that includes a silicon carbide substrate and a light emitting structure formed from the Group III nitride material system on the substrate. The diode has an area greater than 100,000 square microns and has a radiant flux at 20 milliamps current of at least 29 milliwatts at its dominant wavelength between 390 and 540 nanometers.
Abstract translation: 公开了一种发光二极管，其包括碳化硅衬底和由衬底上的III族氮化物材料体系形成的发光结构。 该二极管具有大于100,000平方微米的面积，其在20毫安电流下的辐射通量为至少29毫瓦，其主波长为390至540纳米。
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公开(公告)号：US20080251800A1
公开(公告)日：2008-10-16
申请号：US11734218
申请日：2007-04-11
Applicant: Michael J. Bergmann , Daniel C. Driscoll , David T. Emerson
Inventor： Michael J. Bergmann , Daniel C. Driscoll , David T. Emerson
CPC classification number: H01L33/0079 , H01L21/02378 , H01L21/0242 , H01L21/02458 , H01L21/02505 , H01L21/0251 , H01L21/02513 , H01L21/0254 , H01L33/007
Abstract: A method of forming electronic device precursors and devices with reduced cracking in relevant layers is disclosed along with resulting structures. The method includes the steps of growing a transition layer of undoped Group III nitride on a substrate that is other than a Group III nitride, growing an active structure of Group III nitride on the undoped layer, and removing the substrate from the undoped layer.
Abstract translation: 公开了一种在相关层中形成具有减少的开裂的电子器件前体和器件的方法以及所得到的结构。 该方法包括以下步骤：在不同于III族氮化物的衬底上生长未掺杂的III族氮化物的过渡层，在未掺杂层上生长III族氮化物的活性结构，以及从未掺杂层去除衬底。
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