发明授权
- 专利标题: Method for cleaning film formation apparatus and method for manufacturing semiconductor device
- 专利标题(中): 成膜装置的清洗方法及半导体装置的制造方法
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申请号: US13680187申请日: 2012-11-19
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公开(公告)号: US09044793B2公开(公告)日: 2015-06-02
- 发明人: Satoshi Toriumi , Makoto Furuno
- 申请人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 申请人地址: JP Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Kanagawa-ken
- 代理机构: Nixon Peabody LLP
- 代理商 Jeffrey L. Costellia
- 优先权: JP2011-254546 20111122
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; B08B7/04 ; H01L21/20 ; B08B7/00 ; C23C16/44 ; C23C16/02 ; C23C16/26 ; H01L29/16 ; H01M10/052 ; H01M4/131 ; H01M4/62 ; H01L29/66 ; H01L29/778 ; B82Y40/00
摘要:
A method for cleaning a hot-wall type film formation apparatus having a batch processing system with industrially high mass productivity is provided. In the method, a carbon film deposited on an inner wall or the like of a reaction chamber of the apparatus is removed efficiently in a short time. To remove the carbon film deposited on the inner wall of the reaction chamber by a thermal CVD method, the reaction chamber is heated at a temperature higher than or equal to 700° C. and lower than or equal to 800° C., and oxygen is introduced into the reaction chamber.
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