发明授权
US09050700B2 Methods and apparatus for an improved polishing head retaining ring
有权
用于改进的抛光头保持环的方法和装置
- 专利标题： Methods and apparatus for an improved polishing head retaining ring
- 专利标题（中）： 用于改进的抛光头保持环的方法和装置
-
申请号： US13360221申请日： 2012-01-27
-
公开(公告)号： US09050700B2公开(公告)日： 2015-06-09
- 发明人: Hung Chih Chen , Jay Gurusamy , Gautam S. Dandavate , Samuel Chu-Chiang Hsu
- 申请人： Hung Chih Chen , Jay Gurusamy , Gautam S. Dandavate , Samuel Chu-Chiang Hsu
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Dugan & Dugan, PC
- 主分类号： B24B1/00
- IPC分类号： B24B1/00 ; B24B37/32 ; B24B37/34
摘要：
Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.
公开/授权文献
信息查询
