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公开(公告)号：US10512392B2
公开(公告)日：2019-12-24
申请号：US12866309
申请日：2009-02-06
摘要： One embodiment of present invention is a segmented instrument having braking capabilities that includes an elongate body having a plurality of links and a hinge connecting a pair of adjacent links in the plurality of links. There is also brake assembly coupled to each link in the pair of adjacent links and positioned to span the distance between the pair of adjacent links. Another embodiment of the present invention is a segmented instrument having a plurality of links and at least one lockable and articulatable joint positioned to connect a pair of adjacent links in the plurality of links. In addition, the at least one lockable and articulatable joint is adapted and configured to increase the number of frictional surfaces available between the pair of adjacent links. There are also provided methods for controlling a segmented instrument. Exemplary steps of the method include introducing a segmented instrument into a patient where the segmented instrument has a plurality of links wherein adjacent links are joined by a hinge. Next, there is the step of manipulating the links about the hinges to maneuver the segmented instrument to provide access to a surgical site within the patient. In one aspect, the manipulating step produces a sliding motion between a plurality of complementary shaped components within a portion of a brake assembly between adjacent links. Next there is the step of actuating the brake assembly to substantially prevent movement about the hinge of the links attached to the braking mechanism.
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公开(公告)号：US09050700B2
公开(公告)日：2015-06-09
申请号：US13360221
申请日：2012-01-27
摘要： Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.
摘要翻译： 提供了用于将基板保持在CMP系统的抛光头中的方法，装置和系统。 本发明包括适于轮廓到基底的边缘的柔性内保持环和联接到抛光头的内环支撑。 内支撑环适于通过被抛光的衬底施加到柔性内保持环的侧向力负载而接触柔性内保持环。 公开了许多附加方面。
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公开(公告)号：US20110295065A1
公开(公告)日：2011-12-01
申请号：US12866309
申请日：2009-02-06
CPC分类号： A61B1/0053 , A61B1/0055 , A61B1/0057 , A61B1/008 , A61B1/042 , A61B1/2736 , G02B23/2476
摘要： One embodiment of present invention is a segmented instrument having braking capabilities that includes an elongate body having a plurality of links and a hinge connecting a pair of adjacent links in the plurality of links. There is also brake assembly coupled to each link in the pair of adjacent links and positioned to span the distance between the pair of adjacent links. Another embodiment of the present invention is a segmented instrument having a plurality of links and at least one lockable and articulatable joint positioned to connect a pair of adjacent links in the plurality of links. In addition, the at least one lockable and articulatable joint is adapted and configured to increase the number of frictional surfaces available between the pair of adjacent links. There are also provided methods for controlling a segmented instrument. Exemplary steps of the method include introducing a segmented instrument into a patient where the segmented instrument has a plurality of links wherein adjacent links are joined by a hinge. Next, there is the step of manipulating the links about the hinges to maneuver the segmented instrument to provide access to a surgical site within the patient. In one aspect, the manipulating step produces a sliding motion between a plurality of complementary shaped components within a portion of a brake assembly between adjacent links. Next there is the step of actuating the brake assembly to substantially prevent movement about the hinge of the links attached to the braking mechanism.
摘要翻译： 本发明的一个实施例是具有制动能力的分段仪器，其包括具有多个连杆的细长主体和连接多个连杆中的一对相邻连杆的铰链。 还存在联接到该对相邻链节中的每个链节的制动组件，并且定位成跨越该对相邻链节之间的距离。 本发明的另一个实施例是具有多个链节和至少一个可锁定和可铰接的关节的分段仪器，其定位成连接多个连杆中的一对相邻连杆。 另外，所述至少一个可锁定和可铰接接头适于和构造成增加所述一对相邻链节之间可用的摩擦面数量。 还提供了用于控制分段仪器的方法。 该方法的示例性步骤包括将分段的器械引入到患者中，其中分割的器具具有多个连接件，其中相邻的连接件通过铰链连接。 接下来，存在操纵关于铰链的链接以操纵分段的器械以提供对患者内的手术部位的通路的步骤。 在一个方面，操纵步骤在相邻链节之间的制动器组件的一部分内的多个互补形状的部件之间产生滑动运动。 接下来，存在致动制动组件以基本上防止围绕附接到制动机构的链节的铰链的运动的步骤。
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公开(公告)号：US20200246841A1
公开(公告)日：2020-08-06
申请号：US16777432
申请日：2020-01-30
申请人： Steven M. Zuniga , Jay Gurusamy , Jagan Rangarajan
发明人： Steven M. Zuniga , Jay Gurusamy , Jagan Rangarajan
摘要： A substrate cleaning device may include a chamber body configured to hold a substrate and a brush assembly. The brush assembly may include a first roller, a second roller, and a belt extending between the first roller and the second roller. At least one of the first roller and the second roller may be movable between a first position where the belt contacts a first surface of a substrate disposed in the chamber body and a second position where the belt is spaced from the first surface. Other substrate cleaning devices and methods of cleaning substrates are disclosed.
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公开(公告)号：US20160016284A1
公开(公告)日：2016-01-21
申请号：US14800115
申请日：2015-07-15
申请人： Jay Gurusamy , Hung Chih Chen
发明人： Jay Gurusamy , Hung Chih Chen
IPC分类号： B24B53/017 , B24B37/34
CPC分类号： B24B53/017 , B24B27/0023 , B24B27/0076 , B24B37/013 , B24B37/105 , B24B37/16 , B24B37/205 , B24B37/34 , B24B49/12 , B24B53/005
摘要： A polishing system includes a support to hold a substrate having a substrate surface to be polished, a conditioning system for conditioning a polishing pad, the conditioning system comprising one or more conditioning heads, a movable support structure, and a carrier to hold a polishing pad. The carrier is suspended from the movable support structure, and the support structure is configured to move the carrier between the support to hold the substrate and the conditioning system.
摘要翻译： 抛光系统包括：支撑体，用于保持具有待抛光的基底表面的基底，用于调节抛光垫的调节系统，所述调节系统包括一个或多个调节头，可移动支撑结构和载体以保持抛光垫 。 载体从可移动支撑结构悬挂，并且支撑结构构造成使载体在载体之间移动以保持基板和调节系统。
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公开(公告)号：US20130196577A1
公开(公告)日：2013-08-01
申请号：US13360221
申请日：2012-01-27
IPC分类号： B24B5/00
摘要： Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.
摘要翻译： 提供了用于将基板保持在CMP系统的抛光头中的方法，装置和系统。 本发明包括适于轮廓到基底的边缘的柔性内保持环和联接到抛光头的内环支撑。 内支撑环适于通过被抛光的衬底施加到柔性内保持环的侧向力负载而接触柔性内保持环。 公开了许多附加方面。
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