发明授权
- 专利标题： Contact resistance test structure and method suitable for three-dimensional integrated circuits
- 专利标题（中）： 接触电阻测试结构和适用于三维集成电路的方法
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申请号： US14220804申请日： 2014-03-20
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公开(公告)号： US09053992B2公开(公告)日： 2015-06-09
- 发明人: Huilong Zhu
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 H. Daniel Schnurmann
- 主分类号： G01R31/26
- IPC分类号： G01R31/26 ; H01L21/66 ; G01R31/28 ; H01L21/768
摘要：
A contact resistance test structure, a method for fabricating the contact resistance test structure and a method for measuring a contact resistance while using the contact resistance test structure are all predicated upon two parallel conductor lines (or multiples thereof) that are contacted by one perpendicular conductor line absent a via interposed there between. The test structure and related methods are applicable within the context of three-dimensional integrated circuits.
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