发明授权
US09057760B2 Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
有权
用于检测集成电路芯片中的结构缺陷的电路，使用和制造方法以及设计结构
- 专利标题： Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
- 专利标题（中）： 用于检测集成电路芯片中的结构缺陷的电路，使用和制造方法以及设计结构
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申请号： US13010057申请日： 2011-01-20
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公开(公告)号： US09057760B2公开(公告)日： 2015-06-16
- 发明人: Luke D. Lacroix , Mark C. H. Lamorey , Steven F. Oakland , Janak G. Patel , Kerry P. Pfarr , Peter Slota, Jr. , David B. Stone
- 申请人： Luke D. Lacroix , Mark C. H. Lamorey , Steven F. Oakland , Janak G. Patel , Kerry P. Pfarr , Peter Slota, Jr. , David B. Stone
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Roberts Mlotkowski Safran & Cole, P.C.
- 代理商 Anthony Canale
- 主分类号： G01R31/02
- IPC分类号： G01R31/02 ; G01R31/28
摘要：
Detection circuits, methods of use and manufacture and design structures are provided herein. The structure includes at least one signal line traversing one or more metal layers of an integrated circuit. Circuitry is coupled to the at least one signal line, which is structured to receive a signal with a known signal from the at least one signal line or a signal from a different potential and, based on which signal is received, determine whether there is a structural defect in the integrated circuit.
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