公开(公告)号：US20120187953A1

公开(公告)日：2012-07-26

申请号：US13010057

申请日：2011-01-20

申请人： Luke D. LACROIX ,  Mark C.H. Lamorey ,  Steven F. Oakland ,  Janak G. Patel ,  Kerry P. Pfarr ,  Peter Slota, JR. ,  David B. Stone

发明人： Luke D. LACROIX ,  Mark C.H. Lamorey ,  Steven F. Oakland ,  Janak G. Patel ,  Kerry P. Pfarr ,  Peter Slota, JR. ,  David B. Stone

IPC分类号： G01R31/02

CPC分类号： G01R31/2884 ,  G01R31/2896 ,  H01L21/76895 ,  H01L22/32

摘要： Detection circuits, methods of use and manufacture and design structures are provided herein. The structure includes at least one signal line traversing one or more metal layers of an integrated circuit. Circuitry is coupled to the at least one signal line, which is structured to receive a signal with a known signal from the at least one signal line or a signal from a different potential and, based on which signal is received, determine whether there is a structural defect in the integrated circuit.

摘要翻译： 本文提供了检测电路，使用和制造方法以及设计结构。 该结构包括穿过集成电路的一个或多个金属层的至少一个信号线。 电路耦合到所述至少一个信号线，其被构造为接收具有来自至少一个信号线的已知信号或来自不同电位的信号的信号，并且基于哪个信号被接收，确定是否存在 集成电路中的结构缺陷。

公开(公告)号：US09057760B2

公开(公告)日：2015-06-16

申请号：US13010057

申请日：2011-01-20

申请人： Luke D. Lacroix ,  Mark C. H. Lamorey ,  Steven F. Oakland ,  Janak G. Patel ,  Kerry P. Pfarr ,  Peter Slota, Jr. ,  David B. Stone

发明人： Luke D. Lacroix ,  Mark C. H. Lamorey ,  Steven F. Oakland ,  Janak G. Patel ,  Kerry P. Pfarr ,  Peter Slota, Jr. ,  David B. Stone

IPC分类号： G01R31/02 ,  G01R31/28

CPC分类号： G01R31/2884 ,  G01R31/2896 ,  H01L21/76895 ,  H01L22/32

摘要： Detection circuits, methods of use and manufacture and design structures are provided herein. The structure includes at least one signal line traversing one or more metal layers of an integrated circuit. Circuitry is coupled to the at least one signal line, which is structured to receive a signal with a known signal from the at least one signal line or a signal from a different potential and, based on which signal is received, determine whether there is a structural defect in the integrated circuit.

摘要翻译： 本文提供了检测电路，使用和制造方法以及设计结构。 该结构包括穿过集成电路的一个或多个金属层的至少一个信号线。 电路耦合到所述至少一个信号线，其被构造为接收具有来自至少一个信号线的已知信号或来自不同电位的信号的信号，并且基于哪个信号被接收，确定是否存在 集成电路中的结构缺陷。