发明授权
US09059067B2 Semiconductor device with interposer and method manufacturing same
有权
具有插入器的半导体器件及其制造方法相同
- 专利标题： Semiconductor device with interposer and method manufacturing same
- 专利标题（中）： 具有插入器的半导体器件及其制造方法相同
-
申请号： US13235546申请日： 2011-09-19
-
公开(公告)号： US09059067B2公开(公告)日： 2015-06-16
- 发明人: Yun-seok Choi , So-young Lim , In-won O
- 申请人： Yun-seok Choi , So-young Lim , In-won O
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 代理机构： Volentine & Whitt, PLLC
- 优先权： KR10-2010-0095959 20101001
- 主分类号： H01L29/00
- IPC分类号： H01L29/00 ; H01L23/14 ; H01L21/48 ; H01L23/498 ; H01L25/065
摘要：
A semiconductor device includes an interposer mounting a semiconductor chip. The interposer includes a silicon substrate having a recessed region formed on a first surface, a first through via penetrating a first region of the silicon substrate from the first surface to an opposing second surface, an insulator disposed in the recessed region, and a first wire pattern at least partially disposed on the insulator and electrically connecting the first through via to the semiconductor chip.
公开/授权文献
信息查询
IPC分类:
