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1.
公开(公告)号:US09059067B2
公开(公告)日:2015-06-16
申请号:US13235546
申请日:2011-09-19
申请人: Yun-seok Choi , So-young Lim , In-won O
发明人: Yun-seok Choi , So-young Lim , In-won O
IPC分类号: H01L29/00 , H01L23/14 , H01L21/48 , H01L23/498 , H01L25/065
CPC分类号: H01L23/147 , H01L21/486 , H01L23/49827 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15192 , H01L2924/15311 , H01L2924/19105 , H01L2224/0401
摘要: A semiconductor device includes an interposer mounting a semiconductor chip. The interposer includes a silicon substrate having a recessed region formed on a first surface, a first through via penetrating a first region of the silicon substrate from the first surface to an opposing second surface, an insulator disposed in the recessed region, and a first wire pattern at least partially disposed on the insulator and electrically connecting the first through via to the semiconductor chip.
摘要翻译: 半导体器件包括安装半导体芯片的插入器。 插入器包括硅基板,其具有形成在第一表面上的凹陷区域,穿过硅基板的第一区域的第一通孔从第一表面到相对的第二表面,设置在凹陷区域中的绝缘体和第一引线 至少部分地设置在所述绝缘体上并将所述第一通孔电连接到所述半导体芯片。
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2.
公开(公告)号:US20120091468A1
公开(公告)日:2012-04-19
申请号:US13235546
申请日:2011-09-19
申请人: Yun-seok Choi , So-young Lim , In-won O
发明人: Yun-seok Choi , So-young Lim , In-won O
CPC分类号: H01L23/147 , H01L21/486 , H01L23/49827 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15192 , H01L2924/15311 , H01L2924/19105 , H01L2224/0401
摘要: A semiconductor device includes an interposer mounting a semiconductor chip. The interposer includes a silicon substrate having a recessed region formed on a first surface, a first through via penetrating a first region of the silicon substrate from the first surface to an opposing second surface, an insulator disposed in the recessed region, and a first wire pattern at least partially disposed on the insulator and electrically connecting the first through via to the semiconductor chip
摘要翻译: 半导体器件包括安装半导体芯片的插入器。 插入器包括硅基板,其具有形成在第一表面上的凹陷区域,穿过硅基板的第一区域的第一通孔从第一表面到相对的第二表面,设置在凹陷区域中的绝缘体和第一引线 至少部分地设置在所述绝缘体上并将所述第一通孔电连接到所述半导体芯片
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