发明授权
- 专利标题： Fixing device and thermal module incorporating the same
- 专利标题（中）： 固定装置和包含其的热模块
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申请号： US13467059申请日： 2012-05-09
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公开(公告)号： US09076769B2公开(公告)日： 2015-07-07
- 发明人: Chin-Hsien Chen
- 申请人： Chin-Hsien Chen
- 申请人地址： TW New Taipei
- 专利权人： Foxconn Technology Co., Ltd.
- 当前专利权人： Foxconn Technology Co., Ltd.
- 当前专利权人地址： TW New Taipei
- 代理机构： Novak Druce Connolly Bove + Quigg LLP
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F28F7/00 ; H05K7/00 ; H01L23/467 ; H01L23/40 ; H01L23/427 ; F28D15/02 ; G06F1/20 ; H01L23/367
摘要：
An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material.
公开/授权文献
- US20130135825A1 FIXING DEVICE AND THERMAL MODULE INCORPORATING THE SAME 公开/授权日：2013-05-30
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