Invention Grant
US09081279B2 Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
有权
正性抗蚀剂组合物，用于正性抗蚀剂组合物的树脂，用于合成树脂的化合物和使用正性抗蚀剂组合物的图案形成方法
- Patent Title: Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
- Patent Title (中): 正性抗蚀剂组合物，用于正性抗蚀剂组合物的树脂，用于合成树脂的化合物和使用正性抗蚀剂组合物的图案形成方法
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Application No.: US14158490Application Date: 2014-01-17
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Publication No.: US09081279B2Publication Date: 2015-07-14
- Inventor: Hiromi Kanda , Shinichi Kanna
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-356717 20051209; JP2006-107728 20060410; JP2006-196856 20060719
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004 ; G03F7/075 ; G03F7/20 ; G03F7/30 ; C07C69/653
Abstract:
A positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent; and a pattern forming method using the positive resist composition.
Public/Granted literature
Information query
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