Invention Grant
- Patent Title: Hardening resin composition, sealing material, and electronic device using the sealing material
-
Application No.: US14208009Application Date: 2014-03-13
-
Publication No.: US09082709B2Publication Date: 2015-07-14
- Inventor: Hiroyuki Okuhira , Akira Takakura , Hiroshi Katou
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2013-053447 20130315
- Main IPC: H01L23/29
- IPC: H01L23/29

Abstract:
A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.
Public/Granted literature
- US20140264959A1 HARDENING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC DEVICE USING THE SEALING MATERIAL Public/Granted day:2014-09-18
Information query
IPC分类: