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公开(公告)号：US20150158221A1
公开(公告)日：2015-06-11
申请号：US14414831
申请日：2013-07-10
Applicant: DENSO CORPORATION
Inventor： Ryosuke Izumi , Takashige Saito , Hiroyuki Okuhira , Yuuichi Ikuno , Kouji Yamamoto
CPC classification number: B29C45/16 , B29C43/18 , B29C45/02 , B29C45/14639 , B29C45/1657 , B29C45/1671 , B29C2045/1664 , B29K2101/10 , B29K2101/12 , B29L2031/3481 , G01L19/141 , H01L21/565 , H01L23/3107 , H01L23/3135 , H01L23/3142 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H05K5/0095 , H05K5/065 , H01L2924/00014 , H01L2924/00012
Abstract: An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.
Abstract translation: 电子设备包括与电子部件一体化的第一模制产品和在第一模制产品外部二次模制的第二模制产品。 第一模制产品包括热固性树脂和包含在热固性树脂中的第一添加剂，第二模塑产品包括热塑性树脂和包含在热塑性树脂中并具有与第一添加剂化学键合的反应性基团的第二添加剂 。 在第一模制产品和第二模制产品之间的界面处，第一添加剂和第二添加剂通过选自共价键，离子键，氢键，分子间力，分散力和 扩散。 结果，通过诸如传递模塑法或压缩模塑法的成型技术，可以牢固地确保两个成型产品之间的粘合性。
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2.发明申请RESIN ADDITIVE, POLYPHENYLENE SULFIDE RESIN COMPOSITION, AND ELECTRONIC DEVICE 有权树脂添加剂，聚苯乙烯树脂组合物和电子设备公开(公告)号：US20140262414A1
公开(公告)日：2014-09-18
申请号：US14208101
申请日：2014-03-13
Applicant: DENSO CORPORATION
Inventor： Hiroyuki Okuhira , Akira Takakura , Hiroshi Katou
IPC: C08K5/372
CPC classification number: C08K5/3725 , C08K5/18 , C08L81/02
Abstract: A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. A polyphenylene sulfide resin composition includes the resin additive and a polyphenylene sulfide resin. An electronic device includes a molded product of the polyphenylene sulfide resin composition.
Abstract translation: 用于聚苯硫醚的树脂添加剂包括由以下一般化学式（1）表示的二胺化合物，其中A是氧原子或硫原子，X是氢原子，碳数为6的烷基或 较少或芳基，n为1〜10的自然数。聚苯硫醚树脂组合物包含树脂添加剂和聚苯硫醚树脂。 电子设备包括聚苯硫醚树脂组合物的模制产品。
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公开(公告)号：US10717867B2
公开(公告)日：2020-07-21
申请号：US16096435
申请日：2017-04-17
Applicant: DENSO CORPORATION
Inventor： Hiroyuki Okuhira , Masakazu Atsumi
Abstract: A curable polyurethane type resin composition which is applicable for a sealing material for an electrical device used in a vehicle, enhances a hydrolysis resistance of a cured substance and can suppress a decrease in physical properties in high temperature and high moisture environments. The curable polyurethane type resin composition contains castor oil-type polyol, polyisocyanate, and epoxidized acrylic polymer. The electrical device has electrical components covered with a sealing material consisting of a cured substance of the curable polyurethane-type resin composition.
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4.发明授权Resin additive, polyphenylene sulfide resin composition, and electronic device 有权树脂添加剂，聚苯硫醚树脂组合物和电子器件公开(公告)号：US09290638B2
公开(公告)日：2016-03-22
申请号：US14208101
申请日：2014-03-13
Applicant: DENSO CORPORATION
Inventor： Hiroyuki Okuhira , Akira Takakura , Hiroshi Katou
CPC classification number: C08K5/3725 , C08K5/18 , C08L81/02
Abstract: A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. A polyphenylene sulfide resin composition includes the resin additive and a polyphenylene sulfide resin. An electronic device includes a molded product of the polyphenylene sulfide resin composition.
Abstract translation: 用于聚苯硫醚的树脂添加剂包括由以下一般化学式（1）表示的二胺化合物，其中A是氧原子或硫原子，X是氢原子，碳数为6的烷基或 较少或芳基，n为1〜10的自然数。聚苯硫醚树脂组合物包含树脂添加剂和聚苯硫醚树脂。 电子设备包括聚苯硫醚树脂组合物的模制产品。
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Patent Agency Ranking
5.发明申请公开(公告)号：US20140150973A1
公开(公告)日：2014-06-05
申请号：US14095122
申请日：2013-12-03
Applicant: DENSO CORPORATION
Inventor： Hiroyuki Okuhira , Akira Takakura , Hiroshi Katou
IPC: C09J163/00 , B32B37/12
CPC classification number: C09J163/00 , B32B37/1207 , C08G59/504 , C08L63/00
Abstract: An epoxy resin composition includes: epoxy resin as a main component; and diamine having phenylene oxide skeleton indicated by an equation of: A code of “X” is a hydrogen or a methyl group, and a suffix of “n” is an integer in a range between 1 and 10. In the above composition, the gelation time is short, compared with a case where the epoxy resin composition with using phenylene sulfide skeletal diamine as hardening agent of an epoxy resin.
Abstract translation: 环氧树脂组合物包括：环氧树脂作为主要成分; 和具有由以下等式表示的亚苯基氧化物骨架的二胺：“X”的代码是氢或甲基，后缀“n”是1至10之间的整数。在上述组合物中， 与使用苯硫醚骨架二胺作为环氧树脂硬化剂的环氧树脂组合物相比，凝胶化时间短。
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6.发明授权公开(公告)号：US09082709B2
公开(公告)日：2015-07-14
申请号：US14208009
申请日：2014-03-13
Applicant: DENSO CORPORATION
Inventor： Hiroyuki Okuhira , Akira Takakura , Hiroshi Katou
IPC: H01L23/29
Abstract: A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.
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公开(公告)号：US11795325B2
公开(公告)日：2023-10-24
申请号：US16885710
申请日：2020-05-28
Applicant: DENSO CORPORATION
Inventor： Akira Takakura , Hiroyuki Okuhira , Katsuhiro Kanie
CPC classification number: C08L75/06 , C08G18/6204 , C08G18/6229 , C08G18/73 , C08G18/76 , C09J7/10 , C09J175/04 , C08L2203/16
Abstract: A curable resin composition comprises a (meth)acrylic polyol, a hydrogenated polyolefin-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of −70° C. or more and −40° C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25° C. The hydrogenated polyolefin-based polyol has an iodine value of 15 or less. An electrical component (1) comprises a sealing member (2) including a cured product of the curable resin composition.
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公开(公告)号：US09789637B2
公开(公告)日：2017-10-17
申请号：US14414831
申请日：2013-07-10
Applicant: DENSO CORPORATION
Inventor： Ryosuke Izumi , Takashige Saito , Hiroyuki Okuhira , Yuuichi Ikuno , Kouji Yamamoto
IPC: B29C45/16 , H05K5/00 , H05K5/06 , B29C43/18 , G01L19/14 , H01L21/56 , H01L23/31 , B29C45/14 , B29C45/02 , B29K101/10 , B29K101/12 , B29L31/34
CPC classification number: B29C45/16 , B29C43/18 , B29C45/02 , B29C45/14639 , B29C45/1657 , B29C45/1671 , B29C2045/1664 , B29K2101/10 , B29K2101/12 , B29L2031/3481 , G01L19/141 , H01L21/565 , H01L23/3107 , H01L23/3135 , H01L23/3142 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H05K5/0095 , H05K5/065 , H01L2924/00014 , H01L2924/00012
Abstract: An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.
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9.发明申请HARDENING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC DEVICE USING THE SEALING MATERIAL 审中-公开硬化树脂组合物，密封材料和使用密封材料的电子设备公开(公告)号：US20140264959A1
公开(公告)日：2014-09-18
申请号：US14208009
申请日：2014-03-13
Applicant: DENSO CORPORATION
Inventor： Hiroyuki Okuhira , Akira Takakura , Hiroshi Katou
IPC: H01L23/29
CPC classification number: H01L23/293 , H01L24/73 , H01L2224/32245 , H01L2224/33181 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
Abstract: A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.
Abstract translation: 硬化树脂组合物包括基础树脂和硬化剂。 该基础树脂含有1分子中具有2个以上马来酰亚胺基的马来酰亚胺化合物，硬化剂含有通式（1）表示的二胺化合物，其中A为氧原子或硫原子，X为 氢原子，碳数为6以下的烷基或芳基，n为1〜10的自然数。
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