RESIN ADDITIVE, POLYPHENYLENE SULFIDE RESIN COMPOSITION, AND ELECTRONIC DEVICE
    1.
    发明申请
    RESIN ADDITIVE, POLYPHENYLENE SULFIDE RESIN COMPOSITION, AND ELECTRONIC DEVICE 有权
    树脂添加剂,聚苯乙烯树脂组合物和电子设备

    公开(公告)号:US20140262414A1

    公开(公告)日:2014-09-18

    申请号:US14208101

    申请日:2014-03-13

    CPC classification number: C08K5/3725 C08K5/18 C08L81/02

    Abstract: A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. A polyphenylene sulfide resin composition includes the resin additive and a polyphenylene sulfide resin. An electronic device includes a molded product of the polyphenylene sulfide resin composition.

    Abstract translation: 用于聚苯硫醚的树脂添加剂包括由以下一般化学式(1)表示的二胺化合物,其中A是氧原子或硫原子,X是氢原子,碳数为6的烷基或 较少或芳基,n为1〜10的自然数。聚苯硫醚树脂组合物包含树脂添加剂和聚苯硫醚树脂。 电子设备包括聚苯硫醚树脂组合物的模制产品。

    Resin additive, polyphenylene sulfide resin composition, and electronic device
    3.
    发明授权
    Resin additive, polyphenylene sulfide resin composition, and electronic device 有权
    树脂添加剂,聚苯硫醚树脂组合物和电子器件

    公开(公告)号:US09290638B2

    公开(公告)日:2016-03-22

    申请号:US14208101

    申请日:2014-03-13

    CPC classification number: C08K5/3725 C08K5/18 C08L81/02

    Abstract: A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. A polyphenylene sulfide resin composition includes the resin additive and a polyphenylene sulfide resin. An electronic device includes a molded product of the polyphenylene sulfide resin composition.

    Abstract translation: 用于聚苯硫醚的树脂添加剂包括由以下一般化学式(1)表示的二胺化合物,其中A是氧原子或硫原子,X是氢原子,碳数为6的烷基或 较少或芳基,n为1〜10的自然数。聚苯硫醚树脂组合物包含树脂添加剂和聚苯硫醚树脂。 电子设备包括聚苯硫醚树脂组合物的模制产品。

    EPOXY RESIN COMPOSITION AND MANUFACTURING METHOD OF BONDING STRUCTURE
    4.
    发明申请
    EPOXY RESIN COMPOSITION AND MANUFACTURING METHOD OF BONDING STRUCTURE 审中-公开
    环氧树脂组合物和粘结结构的制造方法

    公开(公告)号:US20140150973A1

    公开(公告)日:2014-06-05

    申请号:US14095122

    申请日:2013-12-03

    CPC classification number: C09J163/00 B32B37/1207 C08G59/504 C08L63/00

    Abstract: An epoxy resin composition includes: epoxy resin as a main component; and diamine having phenylene oxide skeleton indicated by an equation of: A code of “X” is a hydrogen or a methyl group, and a suffix of “n” is an integer in a range between 1 and 10. In the above composition, the gelation time is short, compared with a case where the epoxy resin composition with using phenylene sulfide skeletal diamine as hardening agent of an epoxy resin.

    Abstract translation: 环氧树脂组合物包括:环氧树脂作为主要成分; 和具有由以下等式表示的亚苯基氧化物骨架的二胺:“X”的代码是氢或甲基,后缀“n”是1至10之间的整数。在上述组合物中, 与使用苯硫醚骨架二胺作为环氧树脂硬化剂的环氧树脂组合物相比,凝胶化时间短。

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