公开(公告)号：US09082709B2

公开(公告)日：2015-07-14

申请号：US14208009

申请日：2014-03-13

Applicant: DENSO CORPORATION

Inventor： Hiroyuki Okuhira ,  Akira Takakura ,  Hiroshi Katou

IPC: H01L23/29

Abstract: A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.

公开(公告)号：US11795325B2

公开(公告)日：2023-10-24

申请号：US16885710

申请日：2020-05-28

Applicant: DENSO CORPORATION

Inventor： Akira Takakura ,  Hiroyuki Okuhira ,  Katsuhiro Kanie

IPC: C08L75/06 ,  C09J7/10 ,  C08G18/62 ,  C08G18/73 ,  C08G18/76 ,  C09J175/04

CPC classification number: C08L75/06 ,  C08G18/6204 ,  C08G18/6229 ,  C08G18/73 ,  C08G18/76 ,  C09J7/10 ,  C09J175/04 ,  C08L2203/16

Abstract: A curable resin composition comprises a (meth)acrylic polyol, a hydrogenated polyolefin-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of −70° C. or more and −40° C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25° C. The hydrogenated polyolefin-based polyol has an iodine value of 15 or less. An electrical component (1) comprises a sealing member (2) including a cured product of the curable resin composition.

公开(公告)号：US20140264959A1

公开(公告)日：2014-09-18

申请号：US14208009

申请日：2014-03-13

Applicant: DENSO CORPORATION

Inventor： Hiroyuki Okuhira ,  Akira Takakura ,  Hiroshi Katou

IPC: H01L23/29

CPC classification number: H01L23/293 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10.

Abstract translation: 硬化树脂组合物包括基础树脂和硬化剂。 该基础树脂含有1分子中具有2个以上马来酰亚胺基的马来酰亚胺化合物，硬化剂含有通式（1）表示的二胺化合物，其中A为氧原子或硫原子，X为 氢原子，碳数为6以下的烷基或芳基，n为1〜10的自然数。

公开(公告)号：US20140262414A1

公开(公告)日：2014-09-18

申请号：US14208101

申请日：2014-03-13

Applicant: DENSO CORPORATION

Inventor： Hiroyuki Okuhira ,  Akira Takakura ,  Hiroshi Katou

IPC: C08K5/372

CPC classification number: C08K5/3725 ,  C08K5/18 ,  C08L81/02

Abstract: A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. A polyphenylene sulfide resin composition includes the resin additive and a polyphenylene sulfide resin. An electronic device includes a molded product of the polyphenylene sulfide resin composition.

Abstract translation: 用于聚苯硫醚的树脂添加剂包括由以下一般化学式（1）表示的二胺化合物，其中A是氧原子或硫原子，X是氢原子，碳数为6的烷基或 较少或芳基，n为1〜10的自然数。聚苯硫醚树脂组合物包含树脂添加剂和聚苯硫醚树脂。 电子设备包括聚苯硫醚树脂组合物的模制产品。

公开(公告)号：US09290638B2

公开(公告)日：2016-03-22

申请号：US14208101

申请日：2014-03-13

Applicant: DENSO CORPORATION

Inventor： Hiroyuki Okuhira ,  Akira Takakura ,  Hiroshi Katou

IPC: C08K5/372 ,  C08K5/18

CPC classification number: C08K5/3725 ,  C08K5/18 ,  C08L81/02

Abstract: A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. A polyphenylene sulfide resin composition includes the resin additive and a polyphenylene sulfide resin. An electronic device includes a molded product of the polyphenylene sulfide resin composition.

Abstract translation: 用于聚苯硫醚的树脂添加剂包括由以下一般化学式（1）表示的二胺化合物，其中A是氧原子或硫原子，X是氢原子，碳数为6的烷基或 较少或芳基，n为1〜10的自然数。聚苯硫醚树脂组合物包含树脂添加剂和聚苯硫醚树脂。 电子设备包括聚苯硫醚树脂组合物的模制产品。

公开(公告)号：US20140150973A1

公开(公告)日：2014-06-05

申请号：US14095122

申请日：2013-12-03

Applicant: DENSO CORPORATION

Inventor： Hiroyuki Okuhira ,  Akira Takakura ,  Hiroshi Katou

IPC: C09J163/00 ,  B32B37/12

CPC classification number: C09J163/00 ,  B32B37/1207 ,  C08G59/504 ,  C08L63/00

Abstract: An epoxy resin composition includes: epoxy resin as a main component; and diamine having phenylene oxide skeleton indicated by an equation of: A code of “X” is a hydrogen or a methyl group, and a suffix of “n” is an integer in a range between 1 and 10. In the above composition, the gelation time is short, compared with a case where the epoxy resin composition with using phenylene sulfide skeletal diamine as hardening agent of an epoxy resin.

Abstract translation: 环氧树脂组合物包括：环氧树脂作为主要成分; 和具有由以下等式表示的亚苯基氧化物骨架的二胺：“X”的代码是氢或甲基，后缀“n”是1至10之间的整数。在上述组合物中， 与使用苯硫醚骨架二胺作为环氧树脂硬化剂的环氧树脂组合物相比，凝胶化时间短。