发明授权
US09082714B2 Use of etch process post wordline definition to improve data retention in a flash memory device
有权
使用蚀刻处理后字幕定义来改善闪存设备中的数据保留
- 专利标题: Use of etch process post wordline definition to improve data retention in a flash memory device
- 专利标题(中): 使用蚀刻处理后字幕定义来改善闪存设备中的数据保留
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申请号: US13993444申请日: 2011-09-22
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公开(公告)号: US09082714B2公开(公告)日: 2015-07-14
- 发明人: Randy J. Koval , Max F. Hineman , Ronald A. Weimer , Vinayak K. Shamanna , Thomas M. Graettinger , William R. Kueber , Christopher Larsen , Alex J. Schrinsky
- 申请人: Randy J. Koval , Max F. Hineman , Ronald A. Weimer , Vinayak K. Shamanna , Thomas M. Graettinger , William R. Kueber , Christopher Larsen , Alex J. Schrinsky
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 国际申请: PCT/US2011/052850 WO 20110922
- 国际公布: WO2013/043184 WO 20130328
- 主分类号: H01L21/76
- IPC分类号: H01L21/76 ; H01L21/306 ; H01L29/51 ; H01L29/788 ; H01L29/792 ; H01L27/115
摘要:
Embodiments of the present disclosure are directed towards use of an etch process post wordline definition to improve data retention in a flash memory device. In one embodiment, a method includes forming a plurality of wordline structures on a substrate, wherein individual wordline structures of the plurality of wordline structures include a control gate having an electrically conductive material and a cap having an electrically insulative material formed on the control gate, depositing an electrically insulative material to form a liner on a surface of the individual wordline structures, and etching the liner to remove at least a portion of the liner. Other embodiments may be described and/or claimed.
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