Invention Grant
US09082741B2 Semiconductor device including first and second semiconductor materials
有权
包括第一和第二半导体材料的半导体器件
- Patent Title: Semiconductor device including first and second semiconductor materials
- Patent Title (中): 包括第一和第二半导体材料的半导体器件
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Application No.: US13475319Application Date: 2012-05-18
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Publication No.: US09082741B2Publication Date: 2015-07-14
- Inventor: Stephan Voss , Franz-Josef Niedernostheide , Hans-Joachim Schulze
- Applicant: Stephan Voss , Franz-Josef Niedernostheide , Hans-Joachim Schulze
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L29/08 ; H01L29/861 ; H01L29/739 ; H01L29/161 ; H01L29/165 ; H01L29/167

Abstract:
A semiconductor device includes a first semiconductor region including a first semiconductor material. The semiconductor device further includes a second semiconductor region adjoining the first semiconductor region. The second semiconductor region includes a second semiconductor material different from the first semiconductor material. The semiconductor device further includes a drift or base zone in the first semiconductor region. The semiconductor device further includes an emitter region in the second semiconductor region. The second semiconductor region includes at least one type of deep-level dopant. A solubility of the at least one type of deep-level dopant is higher in the second semiconductor region than in the first semiconductor region.
Public/Granted literature
- US20130307018A1 Semiconductor Device Including First and Second Semiconductor Materials Public/Granted day:2013-11-21
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