Invention Grant
- Patent Title: Adhesive wafer bonding with controlled thickness variation
- Patent Title (中): 粘合剂晶片粘合，控制厚度变化
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Application No.: US13952450Application Date: 2013-07-26
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Publication No.: US09087764B2Publication Date: 2015-07-21
- Inventor: Clayton Ka Tsun Chan , Andreas Bibl
- Applicant: LuxVue Technology Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Luxvue Technology Corporation
- Current Assignee: Luxvue Technology Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L33/00 ; H01L27/15 ; H01L33/06
Abstract:
A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.
Public/Granted literature
- US20150028362A1 ADHESIVE WAFER BONDING WITH CONTROLLED THICKNESS VARIATION Public/Granted day:2015-01-29
Information query
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