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1.发明授权Adhesive wafer bonding with sacrificial spacers for controlled thickness variation 有权粘合晶片与牺牲隔离物接合以控制厚度变化公开(公告)号：US09153548B2
公开(公告)日：2015-10-06
申请号：US14027875
申请日：2013-09-16
Applicant: LuxVue Technology Corporation
Inventor： Clayton Ka Tsun Chan , Andreas Bibl
IPC: H01L27/15 , H01L23/00 , H01L25/075 , H01L33/00
CPC classification number: H01L24/00 , B81C1/00873 , B81C2201/0194 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/156 , H01L33/0079 , H01L2221/68368 , H01L2224/0345 , H01L2224/03848 , H01L2224/04026 , H01L2224/05016 , H01L2224/05023 , H01L2224/05083 , H01L2224/05117 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/0519 , H01L2224/05562 , H01L2224/05564 , H01L2224/05568 , H01L2224/05638 , H01L2224/05644 , H01L2224/05669 , H01L2224/05688 , H01L2224/06181 , H01L2224/2745 , H01L2224/29005 , H01L2224/29007 , H01L2224/291 , H01L2224/29111 , H01L2224/29113 , H01L2224/29139 , H01L2224/29144 , H01L2224/32145 , H01L2224/32227 , H01L2224/83005 , H01L2224/83409 , H01L2224/83411 , H01L2224/83444 , H01L2224/83815 , H01L2224/83825 , H01L2224/8383 , H01L2224/9212 , H01L2224/94 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/01004 , H01L2924/01079 , H01L2924/01032 , H01L2924/01028 , H01L2924/0781 , H01L2224/034 , H01L2224/274 , H01L2924/014 , H01L2224/83
Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers.
Abstract translation: 公开了一种用于形成微器件阵列的方法和结构。 在包括在稳定层中的稳定柱的阵列上形成微器件阵列。 图案化的牺牲间隔物形成在稳定柱之间和微型器件之间。 图案化的牺牲隔离物设置在图案化的牺牲间隔物上。
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2.发明申请公开(公告)号：US20150076528A1
公开(公告)日：2015-03-19
申请号：US14027875
申请日：2013-09-16
Applicant: LuxVue Technology Corporation
Inventor： Clayton Ka Tsun Chan , Andreas Bibl
CPC classification number: H01L24/00 , B81C1/00873 , B81C2201/0194 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/156 , H01L33/0079 , H01L2221/68368 , H01L2224/0345 , H01L2224/03848 , H01L2224/04026 , H01L2224/05016 , H01L2224/05023 , H01L2224/05083 , H01L2224/05117 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/0519 , H01L2224/05562 , H01L2224/05564 , H01L2224/05568 , H01L2224/05638 , H01L2224/05644 , H01L2224/05669 , H01L2224/05688 , H01L2224/06181 , H01L2224/2745 , H01L2224/29005 , H01L2224/29007 , H01L2224/291 , H01L2224/29111 , H01L2224/29113 , H01L2224/29139 , H01L2224/29144 , H01L2224/32145 , H01L2224/32227 , H01L2224/83005 , H01L2224/83409 , H01L2224/83411 , H01L2224/83444 , H01L2224/83815 , H01L2224/83825 , H01L2224/8383 , H01L2224/9212 , H01L2224/94 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/01004 , H01L2924/01079 , H01L2924/01032 , H01L2924/01028 , H01L2924/0781 , H01L2224/034 , H01L2224/274 , H01L2924/014 , H01L2224/83
Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers.
Abstract translation: 公开了一种用于形成微器件阵列的方法和结构。 在包括在稳定层中的稳定柱的阵列上形成微器件阵列。 图案化的牺牲间隔物形成在稳定柱之间和微型器件之间。 图案化的牺牲隔离物设置在图案化的牺牲间隔物上。
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3.发明授权公开(公告)号：US09583466B2
公开(公告)日：2017-02-28
申请号：US14141735
申请日：2013-12-27
Applicant: LuxVue Technology Corporation
Inventor： Kelly McGroddy , Hsin-Hua Hu , Andreas Bibl , Clayton Ka Tsun Chan
CPC classification number: H01L25/0753 , G09G3/32 , H01L24/75 , H01L24/95 , H01L33/0079 , H01L33/0095 , H01L33/14 , H01L33/20 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area in which a current spreading layer protrudes away from a cladding layer in a pillar configuration so that the cladding layer is wider than the current spreading layer pillar.
Abstract translation: 公开了一种用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括限流电流注入区域，其中电流扩散层以柱状构造从包覆层突出，使得包覆层比当前扩展层柱更宽。
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Patent Agency Ranking
4.发明申请公开(公告)号：US20150187740A1
公开(公告)日：2015-07-02
申请号：US14141735
申请日：2013-12-27
Applicant: LuxVue Technology Corporation
Inventor： Kelly McGroddy , Hsin-Hua Hu , Andreas Bibl , Clayton Ka Tsun Chan
CPC classification number: H01L25/0753 , G09G3/32 , H01L24/75 , H01L24/95 , H01L33/0079 , H01L33/0095 , H01L33/14 , H01L33/20 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area in which a current spreading layer protrudes away from a cladding layer in a pillar configuration so that the cladding layer is wider than the current spreading layer pillar.
Abstract translation: 公开了一种用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括限流电流注入区域，其中电流扩散层以柱状构造从包覆层突出，使得包覆层比当前扩展层柱更宽。
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公开(公告)号：US09087764B2
公开(公告)日：2015-07-21
申请号：US13952450
申请日：2013-07-26
Applicant: LuxVue Technology Corporation
Inventor： Clayton Ka Tsun Chan , Andreas Bibl
CPC classification number: H01L27/156 , H01L24/00 , H01L24/75 , H01L24/83 , H01L24/95 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L2224/7598 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.
Abstract translation: 公开了一种用于形成微器件阵列的方法和结构。 在包括在稳定层中的稳定柱的阵列上形成微器件阵列。 稳定层结合到载体基板的间隔侧。 载体基板的间隔件侧包括从载体基板的间隔件侧表面延伸的凸起间隔件。
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公开(公告)号：US09450147B2
公开(公告)日：2016-09-20
申请号：US14194509
申请日：2014-02-28
Applicant: LuxVue Technology Corporation
Inventor： Kelly McGroddy , Hsin-Hua Hu , Andreas Bibl , Clayton Ka Tsun Chan , Daniel Arthur Haeger
IPC: H01L33/14 , H01L27/01 , H01L33/06 , H01L23/00 , G09G3/32 , H01L25/075 , H01L27/15 , H01L33/16 , H01L33/20 , H01L33/00
CPC classification number: H01L33/145 , G09G3/32 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L27/016 , H01L27/156 , H01L33/0016 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/14 , H01L33/16 , H01L33/20 , H01L33/30 , H01L33/42 , H01L2224/75305 , H01L2224/75725 , H01L2224/7598 , H01L2224/82203 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
Abstract translation: 公开了用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括内部限制的电流注入区域，以减少由于边缘效应引起的非辐射复合。 限制电流的几种方式可以包括电流分布层的蚀刻去除，电流分布层和活性层的蚀刻去除，随后的台面再生长，通过离子注入或扩散的分离，量子阱混合和氧化物隔离。
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公开(公告)号：US20150187991A1
公开(公告)日：2015-07-02
申请号：US14194509
申请日：2014-02-28
Applicant: LuxVue Technology Corporation
Inventor： Kelly McGroddy , Hsin-Hua Hu , Andreas Bibl , Clayton Ka Tsun Chan , Daniel Arthur Haeger
CPC classification number: H01L33/145 , G09G3/32 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L27/016 , H01L27/156 , H01L33/0016 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/14 , H01L33/16 , H01L33/20 , H01L33/30 , H01L33/42 , H01L2224/75305 , H01L2224/75725 , H01L2224/7598 , H01L2224/82203 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
Abstract translation: 公开了用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括内部限制的电流注入区域，以减少由于边缘效应引起的非辐射复合。 限制电流的几种方式可以包括电流分布层的蚀刻去除，电流分布层和活性层的蚀刻去除，随后的台面再生长，通过离子注入或扩散的分离，量子阱混合和氧化物隔离。
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公开(公告)号：US20150028362A1
公开(公告)日：2015-01-29
申请号：US13952450
申请日：2013-07-26
Applicant: LuxVue Technology Corporation
Inventor： Clayton Ka Tsun Chan , Andreas Bibl
CPC classification number: H01L27/156 , H01L24/00 , H01L24/75 , H01L24/83 , H01L24/95 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L2224/7598 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.
Abstract translation: 公开了一种用于形成微器件阵列的方法和结构。 在包括在稳定层中的稳定柱的阵列上形成微器件阵列。 稳定层结合到载体基板的间隔侧。 载体基板的间隔件侧包括从载体基板的间隔件侧表面延伸的凸起间隔件。
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