Embodiments include a high temperature electrode connection assembly for a wafer-processing pedestal. The high temperature electrode connection assembly includes an electrode rod having a cup that mounts to a stud embedded in the pedestal and a plate adapter portion. The assembly also includes a floating plate having an outer surface and an aperture for receiving the electrode rod. The floating plate contacts an inner surface of the pedestal to resist lateral movement of the electrode rods. The assembly also includes an anti-rotation retainer ring that frictionally engages the electrode rod and an anti-rotation post extending from the outer surface of the floating plate. The anti-rotation post limits rotation of the electrode rod with respect to the floating plate.