发明授权
- 专利标题: Thermal flow rate sensor
- 专利标题(中): 热流量传感器
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申请号: US13727337申请日: 2012-12-26
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公开(公告)号: US09091578B2公开(公告)日: 2015-07-28
- 发明人: Hiroyuki Okano , Takashi Shirai
- 申请人: HORIBA STEC, Co., Ltd.
- 申请人地址: JP Kyoto-shi
- 专利权人: HORIBA STEC, Co. Ltd.
- 当前专利权人: HORIBA STEC, Co. Ltd.
- 当前专利权人地址: JP Kyoto-shi
- 代理机构: Alleman Hall McCoy Russell & Tuttle LLP
- 优先权: JP2011-286701 20111227
- 主分类号: G01F1/684
- IPC分类号: G01F1/684 ; G01F1/696 ; G05D7/06
摘要:
A thermal flow rate sensor is provided which includes a main flow path through which a fluid flows, and a sensor flow path that branches off from the main flow path so as to cause the fluid to flow in a split flow and that is provided with a flow rate detecting mechanism configured to detect a flow rate of the fluid. The flow rate detecting mechanism includes an upstream-side coil and a downstream-side coil, each configured by using a heat-generating resistance wire wound around a sensor flow pipe forming the sensor flow path. A peak position of a temperature distribution generated in the sensor flow path by the upstream-side coil and the downstream-side coil is positioned on the upstream-side coil side relative to the middle position between the upstream-side coil and the downstream-side coil on the sensor flow path.
公开/授权文献
- US20130160540A1 THERMAL FLOW RATE SENSOR 公开/授权日:2013-06-27
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