发明授权
- 专利标题: Semiconductor device and method for producing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US14083834申请日: 2013-11-19
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公开(公告)号: US09093393B2公开(公告)日: 2015-07-28
- 发明人: Toru Suda
- 申请人: J-DEVICES CORPORATION
- 申请人地址: JP Usuki
- 专利权人: J-DEVICES CORPORATION
- 当前专利权人: J-DEVICES CORPORATION
- 当前专利权人地址: JP Usuki
- 优先权: JP2012-253070 20121119
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/14 ; H01L23/556 ; H01L23/498
摘要:
A semiconductor device includes a rectangular lower semiconductor element; a plurality of external electrodes located in a pattern on the lower semiconductor element along sides thereof; a plurality of internal electrodes electrically connected to the plurality of external electrodes via a plurality of line patterns respectively and located on the lower semiconductor element in a pattern; dams provided in such a pattern that each of the dams encloses one or at least two external electrodes among the plurality of external electrodes; an upper semiconductor element mounted on the lower semiconductor element such that a plurality of terminals on the upper semiconductor element are electrically connected to the plurality of internal electrodes respectively; and a resin potted to flow to a space between the lower semiconductor element and the upper semiconductor element.
公开/授权文献
- US20140138852A1 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME 公开/授权日:2014-05-22