Invention Grant
US09102833B2 Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate body
有权
可固化树脂组合物，可固化树脂成型体，固化树脂成型体，其制造方法和层叠体
- Patent Title: Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate body
- Patent Title (中): 可固化树脂组合物，可固化树脂成型体，固化树脂成型体，其制造方法和层叠体
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Application No.: US14365943Application Date: 2012-12-11
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Publication No.: US09102833B2Publication Date: 2015-08-11
- Inventor: Masaharu Ito , Wataru Iwaya , Hironobu Fujimoto , Naoki Taya
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2011-276247 20111216
- International Application: PCT/JP2012/082052 WO 20121211
- International Announcement: WO2013/089092 WO 20130620
- Main IPC: C08L33/06
- IPC: C08L33/06 ; C08L33/08 ; C08L45/00 ; C08L67/00 ; C08L69/00 ; C08L81/06 ; B05D3/00 ; C08L33/26 ; C08J5/18 ; C09D4/06 ; C08F2/44 ; C08F220/34 ; C08F222/10 ; C08F220/16 ; C08F220/36 ; C08L41/00 ; C08F220/30
Abstract:
Provided is a curable resin composition comprising a thermoplastic resin (A) that includes a cyclic structure in its main chain, and has a glass transition temperature (Tg) of 140° C. or more, and a monofunctional curable monomer (B). The present invention provides: a cured resin formed article that has heat resistance and low birefringence, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.
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